Sumitomo Electric Industries, Limited

Sumitomo Electric Printed Circuits, Inc.

Masahiro Itoh

Koji Nitta

Shoichiro Sakai

Maki Ikebe

Junichi Motomura

Kenji Takahashi

Kousuke Miura

Shingo Nagata

A flexible printed wiring board according to an aspect of the present disclosure is a flexible printed wiring board including a base film and a plurality of wiring lines disposed on a front surface of the base film. Each of the wiring lines has a front end surface extending in a longitudinal direction of the wiring line and two side surfaces extending in the longitudinal direction, and the side surfaces have an arithmetical mean roughness Ra of 0.05 μm to 2.0 μm. The wiring lines have an average height of 40 μm to 120 μm. The wiring lines have an average spacing of 1 μm to 30 μm.

Flexible printed wiring board and method of manufacturing the same

A printed wiring board production method that forms a base film and a conductive pattern on the base film by an additive method or a subtractive method, includes a plating process that electroplates the conductive pattern on a surface of the base film, wherein the plating process includes a shield plate arranging process that arranges a shield plate between an anode and a printed wiring board substrate that forms a cathode, and a substrate arranging process that arranges the printed wiring board substrate in a plating tank, and wherein a distance between the shield plate and the printed wiring board substrate is 50 mm or greater and 150 mm or less.

Printed wiring board production method and printed wiring board production apparatus

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Shiga, Japan

Masahiro Itoh