Denki Kagaku Kogyo Kabushiki Kaisha

National Institute for Materials Science

Stanley Electric Co., Ltd

The University of Electro-Communications

Denka Company Limited

Masahiro Ibukiyama

Hideyuki Emoto

Takashi Kawasaki

Naoto Hirosaki

Hideki Hirotsuru

Takuya Okada

Akira Miyai

Ryozo Nonogaki

Yukihiko Nakajima

Kazuhiro Ito

Kenji Nomura

Mamoru Mitomo

Yasuyuki Miyake

Shuichi Taya

Isao Sugimoto

Tsuguo Hasegawa

Hiroshi Morisaki

Takemi Oguma

Akifumi Ochiai

Shinji Nozaki

Kazuo Uchida

Manabu Uto

Phosphor that can provide white LED that uses a blue LED or an ultraviolet LED as a light source and that has superior luminous efficiency. This phosphor includes, as a main component, &#x3b1;-type sialon represented by a general expression: (M1)x(M2)y(Si,Al)(O,N)(where M1 is one or more types of elements selected from a group consisting of Li, Mg, Ca, Y, and lanthanide element (except for La and Ce) and M2 is one or more types of elements selected from a group consisting of Ce, Pr, Eu, Tb, Yb, and Er, and 0.3&#x2266;X+Y&#x2266;1.5 and 0&#x3c;y&#x2266;0.7 are established and the sialon phosphor consists of a powder having a specific surface area of 0.2 to 0.5 m/g.

Sialon phosphor, process for producing the same, and illuminator and luminescent element employing the same

Provided is a phosphor for a white light emitting device with a blue to ultraviolet light as a light source. A phosphor-containing resin composition comprising phosphor particles of at least one member selected from the group consisting of a nitride and an oxynitride, and a resin of at least one member selected from the group consisting of an epoxy resin, a silicone resin and a fluorine-containing resin.

Phosphor-containing resin composition and sheet, and light emitting devices employing them

A light-emitting device comprising a light source which emits excitation light and a fluorescent substance which absorbs the excitation light to emit light in combination, wherein a fluorescent substance comprising an &#x3b1; type SiAlON represented by the general formula: (Ca,Eu)(Si,Al)(O,N)(1.5&#x3c;&#x3b1;+&#x3b2;&#x3c;2.2, 0&#x3c;&#x3b2;&#x3c;0.2, O/N&#x2266;0.04) as a main component and having a specific surface area of 0.1 to 0.35 m/g is used as the fluorescent substance. This light-emitting device shows little color change due to temperature change and efficiently emits light, even when it is used in a high temperature environment, and it is especially suitable for lighting apparatuses for vehicles such as headlamps.

Light-emitting device, vehicular lighting fixture comprising the device, and head lamp

Provided is a phosphor material for a white LED with a blue LED or ultraviolet LED as a light source. A phosphor comprises an &#x3b1;-sialon represented by the formula: (M1)(M2)(Si)(Al)(O)(N)where M1 is at least one element selected from the group consisting of Li, Mg, Ca, Y and lanthanide metals (except for La and Ce), M2 is at least one element selected from Ce, Pr, Eu, Tb, Yb and Er, 0.3&#x2266;X+Y&#x2266;1.5, 0&#x3c;Y&#x2266;0.7, 0.6&#x2266;m&#x2266;3.0, 0&#x2266;n&#x2266;1.5 and X+Y=m/2; and the oxygen content in a powder of the &#x3b1;-sialon is at most 0.4 mass % larger than a value calculated based on the formula.

Fluorescent substance and process for producing the same, and luminescent element using the same

A &#x3b2; type Sialon fluorescent substance is disclosed that is capable of achieving enhanced brightness of a white light emitting diode using blue to ultraviolet light as a light source. In the fluorescent substance which contains not less than 90% by mass of a &#x3b2; type Sialon composition represented by general formula: SiAlONas a host material wherein z is not less than 0.24 and not more than 0.42, Eu is present dissolved in solid solution as a luminescent center at a content of 0.05 to 0.2% by atom. The &#x3b2; type Sialon fluorescent substance is preferably in the form of a powder having an average particle size of not less than 1 &#x3bc;m and not more than 20 &#x3bc;m. A white LED of good luminescent characteristics can be obtained by using a blue or ultraviolet light emitting diode as a excitation light source in combination with a fluorescent substance that emits yellow or red light.

&#x3b2; type sialon fluorescent substance

An &#x3b1;-sialon is offered which is represented by general formula: (M1)(M2)(Si, Al)(O, N)(wherein M1 represents one or more elements selected from the group which consists of Li, Mg, Ca, Y and lanthanoid (except La and Ce) and M2 represents one or more elements selected from the group which consists of Ce, Pr, Eu, Tb, Yb and Er and wherein 0.3&#x3c;X+Y&#x3c;1.5 and 0&#x3c;Y&#x3c;0.7), the &#x3b1;-sialon containing from 30 ppm to 1% of fluorine as an impurity. By making primary particles of the &#x3b1;-sialon 1 to 10 &#x3bc;m in average particle size, an &#x3b1;-sialon phosphor can be obtained reproducibly, stably and in a large quantity. Especially, if containing 30 to 200 ppm of impurity fluorine, the &#x3b1;-sialon phosphor can exhibit an excellent emission characteristic as a white fluorescent matter.

&#x3b1;-Sialon, &#x3b1;-sialon phosphor and method for producing the same

Crystalline silicon particles of nanometer order usable as a semiconductor element are provided by a method for producing SiOx particles, comprising irradiating SiOx (X is 0.5 or more and less than 2.0) particles each including therein an amorphous silicon particle having a particle diameter of 0.5 to 5 nm with light, and preferably a laser beam, to produce SiOx (X is 0.5 or more and less than 2.0) particles each including therein a crystalline silicon particle having a particle diameter of 1 to 10 nm.

Process for producing siox particles

CAcontaining oxygen radicals at a high concentration, is provided at a low cost. A method for preparing an oxygen radical-containing calcium aluminate film, characterized in that it comprises subjecting a powder of oxygen radical-containing calcium aluminate to thermal spraying, and preferably the oxygen radical content in the oxygen radical-containing calcium aluminate is at least 10cm.

Method for preparing calcium aluminate film containing oxygen radical and laminate

A module is provided that has high reliability in the junction between a ceramic circuit board and a heat sink, undergoes small changes in shape and warp of a module structure comprising a ceramic circuit board and a metal heat sink event under a temperature history during power module assembly and power module actual use, eliminates an unfavorableness during power module assembly, and maintains high reliability over a long period of time. A module structure characterized in that in a module member formed by bonding the ceramic circuit board to the metal heat sink via a metal plate (A) the main component of which is aluminum, the metal plate (A) has a thickness of 400 &#x3bc;m or more and 1,200 &#x3bc;m or less.

Module structure and module comprising it

A substrate for mounting an electronic component, includes a baseplate having a main surface formed with or without a recess. A ceramic substrate is provided on the main surface of the baseplate and has a smaller size than the baseplate. A metal layer is provided to cover both of the baseplate and the ceramic substrate. The metal layer has a surface remote from the baseplate and the ceramic substrate is made flat, the baseplate is made of a metal-ceramic composite of a metallic material and a ceramic material, and the metallic material in the composite and the metal layer have different compositions. Thus, an integral ceramic circuit board, which is resistant to repeated thermal stress and is superior in reliability can be realized.

Method for producing an integral ceramic circuit board

A substrate for mounting an electronic component, including a baseplate having a main surface formed with or without a recess. A ceramic substrate is provided on the main surface of the baseplate and has a smaller size than the baseplate. A metal layer is provided to cover both of the baseplate and the ceramic substrate. The metal layer has a surface remote from the baseplate and the ceramic substrate is made flat, the baseplate is made of a metal-ceramic composite of a metallic material and a ceramic material, and the metallic material in the composite and the metal layer have different compositions. Thereby, an integral ceramic circuit board, which is resistant to repeated thermal stress and is superior in reliability, can be realized.

Growing community of inventors

Tokyo, Japan

Masahiro Ibukiyama