Denso Corporation

Masahiro Honda

Takashige Saito

Shinpei Taga

Koji Hashimoto

Toshihiko Takahata

Haruhisa Koike

Masamoto Kawaguchi

Koutarou Andou

In a manufacturing method of a semiconductor device, a semiconductor chip is sealed with a resin, and then a laser is applied to remove the resin so that a part of the semiconductor chip is exposed. The semiconductor chip is made of a material that has a lower absorptivity of the laser than the resin and is not melted by the laser. The laser has a wavelength that passes through the semiconductor chip and has a lower absorptivity in the semiconductor chip than in the resin. The laser is applied to the resin from a side adjacent to one of plate surfaces of the semiconductor chip, so that the resin sealing the one of the plate surfaces is sublimated and removed and at least a part of the resin sealing the other of the plate surfaces is subsequently sublimated and removed by the laser having passed through the semiconductor chip.

Semiconductor device and method for manufacturing the same

In a manufacturing method of a molded package, a lead frame including an island portion and a support portion is prepared. A circuit chip is mounted on the island portion, and the sensor chip is arranged such that a first end section having an electric connecting portion is adjacent to the circuit chip and a second end section having a sensing portion is supported by the support portion. The circuit chip and the electric connecting portion of the first end section is electrically connected through a connection member. The circuit chip, the island portion, the connection member and the first end section are sealed with a resin while maintaining the support state. After the sealing, the support portion is cut from the lead frame and separated from the second end section.

Manufacturing method of molded package

In manufacturing a sensor device, a sensor chip having a sensing portion on a surface thereof is mounted on one surface of a substrate, and a resin having a volatile property is arranged on the surface of the sensor chip, thereby covering the surface of the sensor chip. Then, the sensor chip and the substrate are sealed by a sealing member. After that, the sealing member is cured, and the resin is heated to be vaporized so that a void is formed between a covered portion in the surface of the sensor chip, which is covered by the sealing member, and the sealing member.

Sensor device and manufacturing method thereof

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Okazaki, Japan

Masahiro Honda