Sumitomo Electric Device Innovations, Inc.

Masahiro Hirayama

Tsutomu Abe

Shuichi Kubota

A 2nd signal line has impedance lower than impedance of a 1st signal line. A capacitor includes a 1st extension part and a 2nd extension part, a 1st ground part and a 2nd ground part. The 1st extension part and the 2nd extension part are connected to a 2nd signal line and are provided on an insulation substrate to extend along a longitudinal direction of the 2nd signal line. The 1st ground part and the 2nd ground part are at least a part of a ground pattern, and are provided between the 1st extension part and the 2nd extension part and the 2nd signal line, and between the 1st extension part and the 2nd extension part and an end part of the insulation substrate, to be electrically coupled with the 1st extension part and the 2nd extension part.

Semiconductor device capable of realizing a wide band impedance matching

Disclosed is an optical semiconductor device including a semiconductor laser chip, an insulation substrate, a ground pattern, a mounted pattern, a resistor and an extension ground pattern. The insulation substrate has a surface mounting the semiconductor laser chip thereon. The ground pattern and the mounted pattern are provided on the surface. The mounted pattern has an opposite side opposite to the ground pattern. The resistor is disposed such that a side edge of the resistor separates from an extension region of the opposite side. The extension ground pattern is positioned in the extension region of the opposite side and is electrically connected to the ground pattern. The capacitor is disposed on the mounted pattern.

Optical semiconductor device and carrier

An optical modulator carrier assembly includes a optical modulator, a transmission line substrate, a first via, a second via and a wire having an inductor component provided on a second surface of the transmission line substrate, and electrically connecting between the another end of the first via and the another end of the second via. The one end of the first via, the cathode electrode pad, the terminating resistor, the one end of the second via are arranged on the in this order.

Optical modulator carrier assembly and optical module

A 2nd signal line has impedance lower than impedance of a 1st signal line. A capacitor includes a 1st extension part and a 2nd extension part, a 1st ground part and a 2nd ground part. The 1st extension part and the 2nd extension part are connected to a 2nd signal line and are on an insulation substrate to extend along a longitudinal direction of the 2nd signal line. The 1st ground part and the 2nd ground part are at least a part of a ground pattern, and are between the 1st extension part and the 2nd extension part and the 2nd signal line, and between the 1st extension part and the 2nd extension part and an end part of the insulation substrate, to be electrically coupled with the 1st extension part and the 2nd extension part.

An optical module with a semiconductor element, which integrates a semiconductor laser diode with an electro-absorption modulator, mounted on a carrier; and an optical transmitter apparatus implementing the optical modules are disclosed. The carrier of the optical module has a back metal connected to the ground on the top thereof through a metal provided in a side surface of the carrier but electrically isolated from the chassis ground of the optical transmitter apparatus. The optical transmitter apparatus installs a plurality of the optical modules on a thermos-electric cooler (TEC) in a top plate thereof. The top plate is electrically isolated from the chassis ground.

Optical transmitter providing coplanar line on carrier

An optical module installed within an optical transmitter apparatus is disclosed. The optical module provides an electrically insulating carrier, a semiconductor element, and a capacitor. The carrier provides a ground pattern and a bias pad. The ground pattern mounts the capacitor and the semiconductor element thereon. The bias pad is electrically isolated from the ground pattern thereby forming a parasitic capacitor against the ground pattern. The optical module further includes at least two bonding wires among a first bonding wire connecting the semiconductor element with the bias pad, a second bonding wire connecting the bias pad with the capacitor, and an additional bonding wire connecting the capacitor with the semiconductor element. The semiconductor element is supplied with a bias current through the at least two bonding wires.

Optical module and optical transmitting apparatus installing a number of optical modules

A signal transmission line is disclosed. The signal transmission line includes a dielectric substrate, a signal line formed on a first surface of the dielectric substrate, a first conductive layer formed on a second surface of the dielectric substrate, and a first stub formed on the first surface of the dielectric substrate, the first stub being electrically connected with the signal line. The first stub includes a plurality of straight areas each extending from a different position of the signal line, a conductor part extending in parallel with the signal line, the conductor part being electrically connected with straight areas, a projection part connected with the conductor part, the projection part extending from the conductor part, and an opening provided between the conductor part and the signal line.

Signal transmission line

A flexible substrate is disclosed. The flexible substrate includes an insulating substrate having a first surface and a second surface opposite to the first surface, a first connection portion having a first conductor, a first ground pattern, and a second ground pattern on the first surface, the first ground pattern and the second ground pattern being spaced apart from the first conductor and respectively located at either side of the first conductor, a conductor pattern formed on the second surface, the conductor pattern being connected to the first conductor, and a third ground pattern formed on the second surface, the third ground pattern being connected to the first ground pattern, wherein a distance between the conductor pattern and the third ground pattern is smaller than a distance between the first conductor and the first ground pattern.

Flexible substrate having a microstrip line connected to a connection portion with a specified conductor pattern

A flexible circuit board includes: an insulative substrate having a first surface and a second surface opposite to the first surface; a microstrip line having a first signal line formed on the first surface and a first ground pattern formed on the second surface and located in an area opposite to the first signal line; a coplanar line having a second signal line formed on the first surface, and second ground patterns that are formed on the first surface and are spaced apart from both sides of the second signal line; a connection line that is formed on the first surface and connects the first signal line and the second signal line together, the connection line having an opening; and third ground patterns formed on the second surface and arranged in areas located at both sides of an area opposite to the connection line including the opening.

Flexible circuit board

An optical modulation device includes: an optical modulator; an insulating layer; an RC circuit including a resistor and a capacitor connected in series; a bonding wire connected between the optical modulator and the RC circuit; a first metal layer provided on the insulating layer; and a second metal layer that has a width larger than that of the first metal layer and is provided on the insulating layer, the second metal layer being connected with a ground potential and being connected to the RC circuit via the first metal layer.

Growing community of inventors

Yokohama, Japan

Masahiro Hirayama