Opnext Japan, Inc.

Oclaro Japan, Inc.

Masahiro Hirai

Hideyuki Kuwano

Satoshi Motohiro

Hiroshi Yamamoto

Daisuke Noguchi

Osamu Kagaya

Keiichi Yamada

Naoki Matsushima

Kazumi Kawamoto

Shohei Hata

Hideo Sotokawa

Toshiaki Takai

Yoshiaki Niwa

Takeshi Yamashita

Kohsuke Shimodate

An optical module includes an optical semiconductor device and a stem including a lead terminal configured to perform at least one of transmitting an electric signal to the optical semiconductor device or transmitting an electric signal output from the optical semiconductor device. The optical module also includes a substrate having a ground layer, a first opening through which the lead terminal passes, and a connecting portion configured to electrically connect the stem and the ground layer. The connecting portion is formed on one of an edge portion of the substrate and a surface of the substrate on a side on which the substrate is arranged on the stem.

Optical module and method of manufacturing optical module

An optical communication module includes a laser that emits laser light, and an electro-absorber that absorbs the laser light, which is emitted from the laser, according to a voltage modulated based on a modulating signal and a bias voltage. The optical communication module detects data that varies correlatively with the temperature of the electro-absorber, and sets the bias voltage, which is associated with the detected data, on the basis of relational data specifying at least the relationship between the bias voltage and the data.

Optical communication module and control method for optical communication module

Provided are an optical transmitter device and an optical transmitter module which are capable of reducing the optical transmitter module size while maintaining a state where an excellent optical transmission waveform quality is obtained over a wide range of frequencies. The optical transmission module () includes a semiconductor laser diode device (), an optical modulator device (), and a first termination resistor circuit (-). A printed circuit board () includes a driver IC () and a second termination resistor circuit (-). A lower cutoff frequency of the first termination resistor circuit (-) and an upper cutoff frequency of the second termination resistor circuit (-) correspond to each other. An impedance of the first termination resistor circuit (-) in a pass frequency band thereof and an impedance of the second termination resistor circuit (-) in a pass frequency band thereof correspond to each other.

Optical transmitter device and optical transmitter module

Disclosed is an optical transmission module in which effects of conductive heat from sides of a metal case upon a thermistor are reduced, thereby allowing steady optical beam wavelengths to be obtained over a wide range of temperatures, regardless of the temperature of the usage environment. Specifically, the optical transmission module includes Peltier elements disposed inside a metal case, a metal base disposed upon the Peltier elements, a laser diode substrate disposed upon the metal base, a laser diode disposed upon the laser diode substrate, a thermistor substrate disposed upon the metal base, a thermistor disposed upon the thermistor substrate, and a thermally conductive member, disposed in the vicinity of the thermistor, that has a height greater than the height of the thermistor.

Optical transmitter and optical communications device

An optical transmitting module of a coaxial type is provided in which a disturbance in a waveform of light which is output from a semiconductor laser element due to a signal which is output from an optical modulator unit can be suppressed. The optical transmitting module comprises an optical transmitting package of a coaxial type and a line board () connected to the optical transmitting package. The optical transmitting package comprises a semiconductor laser element, an optical modulator unit, and a conductor board (). A drive current supply line () and a common ground line are formed over the line board (), and a signal attenuation circuit () having one end electrically connected to the common ground line and the other end electrically connected to the drive current supply line () is provided over the line board ().

Optical transmitting module and optical transmitting device

The present invention provides an optical module and a method for manufacturing the optical module, in which a V-shaped or trapezoidal groove having a first slope and a second slope facing to the first slope is formed at the surface of a silicon substrate by anisotropic etching, an adhesive is applied to a portion of at least the second slope in a region except the first slope of the groove, and lens is fixedly put in the groove.

Growing community of inventors

Yokohama, Japan

Masahiro Hirai