Dainippon Screen Mfg. Co., Ltd.

Masahiro Himoto

Masami Nishida

Tetsuya Hamada

Takeo Okamoto

Noriaki Yokono

Masami Otani

Akio Tsuchiya

A robot (12) takes a wafer (3f) out of an indexer (1) and then transports the same to a heat processing part (41). A wafer (3e), which has already introduced in the heat processing part (41) is took out thereof by the robot (5). The wafer (3f) is introduced in the heat processing part (41) after a waiting time (18a) so that an excess heat processing in the heat processing part (41) can be avoided. The wafer (3e) is transported to a processing part (43) and introduced therein by the robot (5). After the robot (5) repeats the similar processings in processing parts (13, 42, 44), it returns to the wafer transferring robot (12) to receive a next wafer. At that time, the robot (5) waits for a predetermined time thereby a cycle time is adjusted. After the waiting, the robot (5) takes out the wafer (3f), which has been introduced in the heat processing part (41), out thereof. Since the cycle time is set in common for different lots, the waiting times (18a, 18b) are set individually for each lot.

Method of and device for transporting semiconductor substrate in

A wafer transferring device for transferring a wafer to be treated from a wafer supply station of a wafer treating apparatus to a wafer holding member, where the wafer is treated, and from the holding member to a wafer discharge station. The device includes a transfer unit for separately supporting untreated and treated wafers at different heights relative to one another. A carrier unit moves horizontally and reciprocates between the supply and discharge stations and toward and away from the holding member integrally with the transfer unit and is adapted to move up and down the transfer unit.

Wafer transferring device

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Kyoto, Japan

Masahiro Himoto