Hamamatsu-photonics K.k.

Masahiro Hayashi

Katsumi Shibayama

Yutaka Kusuyama

Akio Suzuki

Yuuya Washiyama

Katsutoshi Nonaka

Etsuo Iizuka

Masahiko Iguchi

A charged particle detector includes a microchannel plate having an input surface having electrons (charged particles) input thereon, a multiplication portion performing multiplication of electrons while maintaining positional information of the electrons, and an output surface outputting electrons multiplied by the multiplication portion; a multi-dynode having a plurality of dynodes multiplying the electrons output from the output surface, and insulation regions positioned between the dynodes; and an anode disposed in a spatial region between the output surface and the multi-dynode, and having collection portions for collecting electrons multiplied by the dynodes and aperture portions for allowing electrons output from the output surface to pass therethrough to the dynodes side. All of the insulation regions overlap the collection portions when viewed in an output direction of the electrons from the output surface.

Charged particle detector

An MCP assembly of this embodiment is provided with an MCP unit and a flexible sheet electrode having a structure for facilitating handling thereof as a single body. The flexible sheet electrode is constituted by a mesh area provided with plural openings and a deformation suppressing portion surrounding the mesh area. Both the mesh area and the deformation suppressing portion are comprised of the same conductive material, and physical strength of the deformation suppressing portion is higher than that of the mesh area. With this configuration, the physical strength of an entire flexible sheet electrode is secured even if an opening ratio of the mesh area is increased, so that the handling of the flexible sheet electrode as a single body is facilitated.

MCP assembly and charged particle detector

The MCP assembly of this embodiment is formed at least of a conductive upper support member, an MCP unit, an output electrode, a flexible sheet electrode, and a conductive lower support member as a structure for improving handleability of a flexible sheet electrode having a mesh area. The flexible sheet electrode includes the mesh area provided with plural openings. The flexible sheet electrode and the lower support member are physically and electrically connected to each other, and the flexible sheet electrode is sandwiched between the upper support member and the lower support member. As a result, even if the flexible sheet electrode becomes thin as an opening ratio of the mesh area increases, potential is set while the flexible sheet electrode is firmly held in the MCP assembly.

The present embodiment relates to a charged-particle detector, etc. provided with a structure for effectively suppressing ion feedbacks under a low-vacuum environment. In order to capture the residual-gas ions, which are generated by collisions between the electrons output from a MCP unitand residual-gas molecules, by a second electrode, which is electrically insulated from a first electrode, which is mainly for capturing electrons, the potential of the first electrodeis set to be higher than an output-side potential of the MCP unit, and, on the other hand, the potential of the second electrodeis set to be lower than the output-side potential of the MCP unit. As a result, the ion feedbacks to the MCP unitare effectively suppressed.

Charged-particle detector and method of controlling the same

An embodiment of the invention relates to a TOF-MS capable of performing mass spectrometry of a sample at a high throughput. The TOF-MS has an acceleration part for accelerating an ion, a detector for detecting an event of arrival of the accelerated ion, and a data processing part for performing mass spectrometry of the sample, based on a time of flight of the ion. A first structure of the detector includes an MCP, a dynode, and an anode. In the first structure, the dynode is set at a potential higher than that of an output face of the MCP. The anode is disposed at an intermediate position between the MCP and the dynode or on the dynode side with respect to the intermediate position. The anode has plural apertures and is set at a potential higher than that of the dynode.

Time-of-flight mass spectrometer

An embodiment of the invention relates to a SEM enabling a surface analysis of a sample at a high throughput. The SEM has an electron gun, an irradiation unit, and a detector. The detector, as a first structure, includes an MCP, an anode, and a dynode. The dynode is set at a potential higher than a potential of an output face of the MCP and the anode is set at a potential higher than that of the dynode. The anode is disposed on the dynode side with respect to an intermediate position between the output face of the MCP and the dynode. The anode has an aperture for letting electrons from the output face of the MCP pass toward the dynode.

Scanning electron microscope

In a charged particle detecting apparatusfor which an MCP is sandwiched with an IN electrodeand an OUT electrode and an anode electrode and a rear cover are installed therebehind, the component members in the rear of the IN electrodeare arranged further inside than the IN electrodewhen viewed from an MCP incident surface, and the charged particle detecting apparatusis fixed by screwing and the like to a cabinet wall surfaceof a TOF-MS by using a flange portion provided at a part of IN electrodeprojected further outside than the rear component members.

Time of flight mass spectrometer and charged particle detector therefor

In an MCP assemblyhaving one or a plurality of MCPssandwiched with an input-side electrodeand an output-side electrode, there provided at the surface facing the MCPof at least either (preferably, both) of the input-side electrodeand the output-side electrode, is a substantially annular contact face that contacts the MCP surface to fix the same, and there provided at a periphery of the contact face is a separation surface retracted in a direction to be separated from the MCP surface. Thereby, provided is an MCP assembly having a construction enabled to prevent damage to the MCP in manufacturing and handling.

Micro channel plate assembly

A wiring substrate, comprising a glass substrate, which is provided with through holes, each having a tapered partthat becomes large in opening area at the side of an input surface, and conductive members, formed on the inner walls of through holes, is used. A semiconductor deviceis arranged by connecting bump electrodes, provided on an output surfaceof a PD arrayin correspondence with conductive members, to input portionsof conductive membersformed on input surfaceof wiring substrate. A radiation detector is arranged by connecting a scintillatorvia an optical adhesive agentto a light-incident surfaceof PD arrayand connecting a signal processing elementvia bump electrodesto output surfaceof wiring substrate. A semiconductor device, with which the semiconductor elements and the corresponding conductive paths of the wiring substrate are connected satisfactorily, and a radiation detector using this semiconductor device are thus provided.

Semiconductor device and radiation detector employing it

A wiring substrate to which a semiconductor elementis connected, is a wiring substratecomprised of a glass substrate with through-hole groupsd, each group consisting of a plurality of through holesc extending from input surfacea to output surfaceb and formed in a predetermined array, and conductive membersformed on respective inner walls of the through holesc in each through-hole groupd so as to establish electrical continuity between input surfacea and output surfaceb. A bump electrodeof semiconductor elementconnected to the input surfacea corresponds to each through-hole groupd, conductive member, and conductive partformed in a region covering the through-hole groupd, and is connected so that a portion of the bump electrodeenters into an interior of each of the through holesc. This provides a semiconductor device in which good connection is made between the semiconductor element and the corresponding conduction path in the wiring substrate, and a radiation detector using it.

The present invention relates to a charged-particle detecting apparatus having a structure which enables adjustment of a potential distribution so as to stably maintain flight loci of charged particles without depending on a change in a voltage-applied state. The charged-particle detecting apparatus comprises a first electrode, an MCP, a second electrode, a third electrode that functions as an anode, and a rear cover arranged in order along a predetermined reference axis. The third electrode is arranged on the opposite side of the MCP with respect to the second electrode, and is electrically connected to an output signal part via a capacitor. In particular, the first electrode is arranged so as to become a part of the outer surface of the charged-particle detecting apparatus, and components positioned between the first electrode and the rear cover have contours with section sizes equal to or smaller than that of the contour of the first electrode when viewed from the first electrode side toward the rear cover.

Charged-particle detecting apparatus

The present invention relates to an MCP unit or the like having a structure intended to achieve a desired time response characteristic, without depending on a limitation imposed by a channel diameter of MCP. The MCP unit comprises the MCP for releasing secondary electrons internally multiplied in response to incidence of charged particles, an anode arranged in a position where the secondary electrons reach, and an acceleration electrode arranged between the MCP and the anode. In particular, the acceleration electrode includes a plurality of openings which permit passing of the secondary electrons migrating from the MCP toward the anode. Further, the acceleration electrode is arranged such that the shortest distance B between the acceleration electrode and the anode is longer than the shortest distance A between the MCP and the acceleration electrode. Thus, an FWHM of a detected peak appearing in response to the incidence of the charged particles is remarkably shortened.

MCP unit, MCP detector and time of flight mass spectrometer

A wiring substrate, comprising a glass substrate, formed by integrally bundling a plurality of glass fibers and provided with through holes, and conductive members, disposed at through holes, is used. Input portionsof conductive members, formed on an input surfaceof this wiring substrate, are connected to bump electrodes, which are provided on an output surfaceof a PD arrayin one-to-one correspondence with respect to conductive members, thereby arranging a semiconductor device. A radiation detector is arranged by connecting a scintillatorvia an optical adhesive agentto a light-incident surfaceof PD arrayand connecting a signal processing elementvia bump electrodesto output surfaceof wiring substrate. A semiconductor device, with which the semiconductor elements and the corresponding conductive paths of the wiring substrate are connected satisfactorily, and a radiation detector using this semiconductor device are thus provided.

A wiring substrate sectionis provided between a radiation detecting sectionwhich is formed of a scintillatorand a PD arrayand signal processing elementsandfor processing a detected signal outputted from the PD arrayand the wiring substrate sectionhas a wiring substratewhich is formed of a glass material having a radiation shielding function and in which a conductive memberserving as a conduction path for guiding the detected signal therethrough is provided in a through hole. Relative to the through holeof the wiring substratethe signal processing elementsandof the signal processing sectionlocated downstream of the wiring substrateare each disposed in an area excluding those areas on the extension of the through holes, and this allows the signal processing elementsandnot to be seen through the through holes. This arrangement realizes a radiation detector which suppresses radiation made incident on the signal processing means located downstream of the wiring substrate.

Radioactive ray detector

A wiring substrate section, which has a wiring substratewith through holeseach filled with a conductive memberserving as a conduction path for guiding a detected signal, is installed between a radiation detecting sectioncomprised of a scintillatorand a PD array, and a signal processing elementfor processing the detected signals outputted from the PD array. Each through holein the wiring substrateis formed so that, with respect to a predetermined plane perpendicular to a conduction direction from an input surfaceto an output surface, an aperture of the through holein that plane is not on an extension along the conduction direction of an aperture of the through holein the input surfaceand so that the through holecannot be seen through from the input surfaceto the output surface. This obtains the wiring substrate capable of suppressing transmission of radiation, and a radiation detector using it.

Growing community of inventors

Hamamatsu, Japan

Masahiro Hayashi