Ihi Corporation

Masahiro Hato

Hiroaki Hatanaka

Yuuki Nagai

Seiichi Ohmori

Tomohiko Shiota

Provided is a thickness measurement device, including: an ultrasonic transmitter configured to transmit ultrasonic waves to a measurement object; an ultrasonic receiver configured to receive the ultrasonic waves reflected by the measurement object; a first extraction unit configured to extract a first reflected wave reflected by a first surface in the measurement object; a second extraction unit configured to extract a plurality of candidates for a second reflected wave reflected by a second surface in the measurement object; a matching degree calculation unit configured to calculate a matching degree between the first reflected wave and each of the plurality of candidates, for the each of the plurality of candidates; a candidate determination unit configured to determine, from the plurality of candidates, a candidate having the largest matching degree as the second reflected wave; and a thickness calculation unit configured to calculate a thickness of the measurement object.

Thickness measurement device and thickness measurement method

A damage evaluation device includes: a phased array probe that irradiates an ultrasonic signal from a surface of an inspection metal toward an inside of the inspection metal and detects a reflection signal reflected in a predetermined region inside the inspection metal; and an arithmetic processor. The arithmetic processor sets planes parallel to each other in an inspection region, calculates pixel data by quantifying the reflection signal from segments set in each of the planes; calculates a scattering degree of the pixel data, and evaluates damage of the inspection metal based on the scattering degree.

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Tokyo, Japan

Masahiro Hato