Osaka Kongo Seito Co., Ltd.

Kabushiki Kaisha Toshiba

Tokyo Shibaura Denki Kabushiki Kaisha

Masahiro Hashimoto

Hideo Tani

A grinding wheel comprising abrasive grains each of which is coated with a conductive material and a non-conductive binder interposed among said abrasive grains. The amount of said conductive material ranges from 30 to 80% by weight based on said abrasive grains. The abrasive grains coated with said conductive material is contained in said grindstone in an amount ranging from 33 to 64% by volume. A method of producing said grinding wheel is also proposed. The method comprises preparing a mixture of said coated abrasive grains and said non-conductive binder, filling the mixture into a mold and molding said mixture by applying a pressure while maintaining said mixture at a constant temperature.

Grinding wheel manufacturing method

A grinding wheel which comprises a number of abrasive grains coated with an electrically conductive material, an electrically non-conductive bond having a number of diamond filler dispersed therein. A method of producing the grinding wheel which comprises preparing a mixture of coated abrasive grains, non-conductive bond and diamond filler, filling the mixture into a mold and molding said mixture by applying a pressure while maintaining said mixture at a constant temperature.

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Kamakura, Japan

Masahiro Hashimoto