Seiko Epson Corporation

Masahiro Fujii

Hiroshi Koeda

Hiroyuki Maruyama

Koji Kitahara

Keiichi Mukaiyama

Hiroyuki Ishikawa

Ikuhiro Miyashita

Yasushi Matsuno

Taro Takekoshi

Yoshifumi Hano

Tadaaki Hagata

Naoki Kobayashi

Shigeo Nojima

Akira Sano

Kazuhiko Sato

Ryuichi Kurosawa

Tomohiro Makigaki

Shinri Sakai

Mitsuro Atobe

Osamu Nakamura

Shigeo Sugimura

Asahiro Oguchi

Masahiro Kamijo

Shinichi Yotsuya

Katsuji Arakawa

Mitsukazu Kurose

Takaaki Akiyama

Atsushi Yamaji

Shinichi Kamisuki

Seiichi Fujita

Shuji Matsuo

Masahiro Minowa

Fumio Takagi

Tomoyuki Kamakura

Tomonori Matsushita

Hiroshi Komatsu

Tsutomu Yamazaki

Yuji Kawase

Eiichi Sato

Yoshihiro Ohno

Hiroshi Takizawa

Toshiaki Watanabe

Yoshio Maeda

Susumu Hama

Hitoshi Tanbo

Motoki Itoda

Noriyoshi Otsuki

A vibration device includes a base, a vibrator disposed at the base, an annular resin element that is bonded to the base and surrounds the vibrator in a plan view, and a lid so disposed that the vibrator is sandwiched between the base and the lid. A first metal layer is disposed at a surface of the resin element, the surface facing the lid. A second metal layer is disposed at a surface of the lid, the surface facing the resin element. The vibrator is encapsulated by the base, the resin element, and the lid when the first metal layer and the second metal layer are bonded to each other.

Vibration device

A vibration device includes a semiconductor substrate having a first surface at which an integrated circuit is provided and a second surface that is a rear surface with respect to the first surface, which is a front surface, a vibration element disposed at the first surface, a lid having a recess that opens toward the first surface and a contact surface that is in contact with the first surface, the lid being bonded to the first surface via the contact surface, and a metal layer disposed between the first surface and the contact surface, and at least part of the integrated circuit overlaps with the metal layer in a plan view viewed in the direction of a normal to the first surface.

A resonator device includes: a resonator element that has a first surface on which a first mount electrode and a second mount electrode are disposed, and a second surface; a base that has a third surface which faces the first surface of the resonator element and on which a first base electrode and a second base electrode are disposed; a lid that has a fourth surface which faces the second surface of the resonator element; a first metal bump by which the first mount electrode and the first base electrode are bonded; a second metal bump by which the second mount electrode and the second base electrode are bonded; and a bonding member by which the second surface and the fourth surface are bonded. A loss tangent of the bonding member is larger than a loss tangent of the first metal bump and the second metal bump.

Resonator device

A resonator device includes: a base including a semiconductor substrate; a resonator element; and a lid to be bonded to the base, the lid and the base forming a cavity for accommodating the resonator element. An integrated circuit is disposed at the semiconductor substrate, the integrated circuit including an oscillation circuit electrically coupled to the resonator element, a memory circuit configured to store a reference value of an output characteristic of the resonator element, and a determination circuit configured to compare a detection value of the output characteristic of the resonator element with the reference value and determine an airtight state inside the cavity based on a comparison result.

Resonator device and method for manufacturing resonator device

A resonator device includes a base substrate that is formed of a single crystal semiconductor and includes a first surface, a resonator element attached to the first surface of the base substrate, and a cover that is bonded to the first surface of the base substrate, accommodates the resonator element between the cover and the base substrate, and is formed of a single crystal semiconductor. The base substrate and the cover are bonded through an amorphous layer.

Resonator device, resonator module, electronic apparatus, and vehicle

A resonator device includes a base, a resonator element attached to the base, a cover accommodating the resonator element between the base and the cover, and a conductive bonding member positioned between the base and the cover and bonding the base to the cover. The base includes a resonator element mount surface on which the resonator element is attached, a first interconnect and a second interconnect that are arranged on the resonator element mount surface and that are electrically coupled to the resonator element, a bonding surface bonded to the cover through the bonding member, and a step between the resonator element mount surface and the bonding surface.

A droplet discharging head, includes: a discharging chamber; a plurality of nozzle orifices discharging droplets and each of the plurality of nozzle orifices is communicated with the discharging chamber; an actuator; a vibrating plate provided using a bottom wall of the discharging chamber and displaceably driven by the actuator; and a reservoir commonly communicated with each discharging chamber. The discharging chamber, the actuator, and the reservoir are each segmented on separate planes and stacked in this order in a manner that a projection plane in a direction perpendicular to a formation plane of the reservoir is contained in formation planes of the actuator and the discharging chamber.

Droplet discharging head, manufacturing method thereof, and droplet discharging device

To allow formation of an insulation film to be applied even to a glass substrate without depending on a substrate material so as to improve pressure generated by an electrostatic actuator, as well as to achieve improvement in driving stability and driving durability of the electrostatic actuator at a low cost. An electrostatic actuator including an individual electrode formed on a substrate, a vibration plate arranged opposite to the individual electrode via a predetermined gap and a driving means for causing a displacement of the vibration plate by generating an electrostatic force between the individual electrode and the vibration plate includes an insulation film provided on one or both of opposing surfaces of the fixed electrode and the movable electrode and a surface protection film provided on the insulation film. The surface protection film is made of a hard ceramic film or a hard carbon film.

Electrostatic actuator, liquid droplet discharging head, methods for manufacturing them, and liquid droplet discharging apparatus

To provide an electrostatic actuator capable of attaining a large diaphragm displacement by low voltage drive. Furthermore, a droplet discharge head provided with this electrostatic actuator, a method for driving a droplet discharge head, and a method for manufacturing an electrostatic actuator are provided. A diaphragm, an individual electrodefacing the diaphragmwith a gaptherebetween, while a voltage is applied between the diaphragmand the individual electrode, and an insulating filmwhich is disposed on a surface of the diaphragm, the surface facing the individual electrode, are included, wherein the insulating filmis converted to an electret.

Electrostatic actuator, droplet discharge head, method for driving droplet discharge head, and method for manufacturing electrostatic actuator

An electrostatic actuator comprises: a fixed electrode formed on a substrate; a movable electrode placed at an position opposing the fixed electrode via a predetermined gap; a driving unit giving the movable electrode a displacement by generating an electrostatic force between the fixed electrode and the movable electrode: and an insulation film made of HfAlOformed on an opposing surface of at least one of the fixed electrode and the movable electrode.

Electrostatic actuator, droplet discharging head, method of manufacturing thereof and droplet discharging device

An electrostatic actuator includes a fixed electrode formed on a substrate, a movable electrode provided so as to oppose the fixed electrode with a predetermined gap therebetween, a driving unit generating electrostatic force between the fixed electrode and the movable electrode and moving the movable electrode, insulating films provided on opposing faces of the fixed electrode and the movable electrode, at least one of the insulating films having a layered structure of silicon oxide and a dielectric material whose relative permittivity is higher than the relative permittivity of the silicon oxide, and a surface protection film provided one or both of the insulating films and made of a ceramics-based hard film or a carbon-based hard film.

Electrostatic actuator, droplet discharge head, methods for manufacturing the same and droplet discharge apparatus

To allow formation of an insulation film to be applied even to a glass substrate without depending on a substrate material so as to improve pressure generated by an electrostatic actuator, as well as to achieve improvement in driving stability and driving durability of the electrostatic actuator at a low cost. [Solving Means] An electrostatic actuator including an individual electrodeformed on a substrate, a vibration platearranged opposite to the individual electrodevia a predetermined gap and a driving means for causing a displacement of the vibration plateby generating an electrostatic force between the individual electrodeand the vibration plateincludes an insulation filmprovided on one or both of opposing surfaces of the fixed electrode and the movable electrode and a surface protection filmprovided on the insulation film. The surface protection filmis made of a hard ceramic film or a hard carbon film.

To provide an electrostatic actuator capable of attaining a large diaphragm displacement by low voltage drive. Furthermore, a droplet discharge head provided with this electrostatic actuator, a method for driving a droplet discharge head, and a method for manufacturing an electrostatic actuator are provided. A diaphragm, an individual electrode facing the diaphragm with a gap therebetween, while a voltage is applied between the diaphragm and the individual electrode, and an insulating film which is disposed on a surface of the diaphragm, the surface facing the individual electrode, are included, wherein the insulating film is converted to an electret.

A droplet jet head includes a nozzle substrate having a plurality of nozzle holes; a cavity substrate having recesses whose bottoms serve as diaphragms, and the recesses serving as ejection chambers; an electrode substrate having separate electrodes opposed to the diaphragms; a reservoir substrate having a recess serving as a common droplet chamber for supplying droplets to the ejection chambers, through holes for transferring the droplets from the common droplet chamber to the ejection chambers, and nozzle communicating holes for transferring the droplets from the ejection chambers to the nozzle holes; and a driver IC that supplies a driving signal to the separate electrodes. The cavity substrate has a first hole, and the reservoir substrate has a second hole. The first hole and the second hole communicate with each other to form a housing. The driver IC is housed in the housing.

Droplet jet head and droplet jet apparatus

Growing community of inventors

Shiojiri, Japan

Masahiro Fujii