Hitachi Chemical Company, Ltd.

Masahiro Aoshima

Hikari Murai

Yasuo Kamigata

Yoshihiro Takahashi

Yuka Yamazaki

Tomohiko Kotake

Masato Miyatake

Hiroyuki Ishibashi

Hiroyuki Izumi

Keiji Sumiya

Shinji Tsuchikawa

Shigenori Shimizu

Senguttuvan Nachimuthu

Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.

Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate

A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer includes a resin composition containing a thermosetting resin and an inorganic filler and the glass substrate layer accounts for from 10 to 95% by volume of the entire laminate body. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer includes a cured product of the resin composition. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing the laminate plate including a cured resin layer forming step of forming the cured resin layer on the surface of a glass substrate.

Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate

A laminate body containing one or more resin composition layers and two or more glass substrate layers, wherein at least one layer of those resin composition layers is between glass substrate layers, and is a fiber-containing resin composition layer of a composition that contains a thermosetting resin and a fibrous base material. A laminate plate containing one or more cured resin layers and two or more glass substrate layers, wherein at least one layer of those cured resin layers is between glass substrate layers, and is a fiber-containing cured resin layer of the fiber-containing resin composition. A printed wiring board having the above-mentioned laminate plate and a wiring provided on the surface thereof. A method for producing the laminate plate.

A scintillator crystal represented by the following general formula (1).LnCeX:M&#x2003;&#x2003;(1)wherein LnCeXrepresents the chemical composition of the matrix material, Ln represents one or more elements selected from the group consisting of rare earth elements, X represents one or more elements selected from the group consisting of halogen elements, M is the constituent element of the dopant which is doped in the matrix material and represents one or more elements selected from the group consisting of Li, Na, K, Rb, Cs, Al, Zn, Ga, Be, Mg, Ca, Sr, Ba, Sc, Ge, Ti, V, Cu, Nb, Cr, Mn, Fe, Co, Ni, Mo, Ru, Rh, Pb, Ag, Cd, In, Sn, Sb, Ta, W, Re, Os, Ir, Pt, Au, Hg, Tl and Bi, and y represents a numerical value satisfying the condition represented by the following inequality (A):0.0001&#x2266;y&#x2266;1&#x2003;&#x2003;(A).

Scintillator crystal and radiation detector

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Ibaraki, Japan

Masahiro Aoshima