Olympus Corporation

Masahiko Yazawa

Shunsuke Kurata

Katsuyuki Hashimoto

Yasunori Ikeno

Haruyuki Tsuji

Yasutoshi Kitahara

It is an object of the present invention to provide a substrate processing apparatus, comprising a housing body mounting unit that is capable of mounting a plurality of housing bodies which can house a plurality of substrates, a processing apparatus main body for processing a substrate extracted from the housing body, a transportation unit for transporting the substrate between the housing body and the processing apparatus main body, a processing control unit for controlling the transportation unit and making it transport the substrate between the housing body and the processing apparatus main body, and a transportation control unit for controlling the transportation unit and making it transport the substrate from one housing body to another housing body without passing through the processing apparatus main body.

Substrate processing apparatus and substrate processing system

A semiconductor wafer inspection apparatus is provided with a rotatable table on which a semiconductor wafer is held by suction, an illuminating device which illuminates at least an edge portion of the semiconductor wafer held on the rotatable table, an imaging device which captures an image of the edge portion of the semiconductor wafer when the edge portion is illuminated by the illuminating device, an image processing device which detects at least an edge cut amount or a crack by acquiring the image of the edge portion which is captured by the imaging device, and a display section which displays an image of the edge portion subjected to image processing by the image processing device.

Growing community of inventors

Tokyo, Japan

Masahiko Yazawa