Tokyo Electron Limited

Hitachi, Ltd.

Tohoku University

Masahiko Sugiyama

Naoki Akiyama

Shigetaro Tagawa

Michikazu Nakamura

Mitsuru Murata

Masahiro Takebayashi

Hiroshi Iwata

Masataka Hatta

Yosuke Omori

Kazumi Yamagata

Kazuo Sekigami

Hajime Furuya

Akio Sakazume

Eiji Miyata

Masahiko Kohno

Yoshinori Inoue

Mitsumasa Koyanagi

Haruhiko Yoshioka

Munetoshi Nagasaka

Hideo Uzuhashi

Kenichi Iizuka

Takafumi Fukushima

Dai Shinozaki

Yoshihisa Uneyama

Takashi Seshita

Gen Konno

Minoru Ooki

Yoshihiko Nakamura

Masatune Sutou

Akihisa Hamaguchi

Noriaki Arawaka

Osamu Kamata

A joining device includes a first holding unit configured to load and hold the first member on its top surface; a second holding unit disposed above the first holding unit while facing the first holding unit and configured to hold the second member; and a position adjustment mechanism configured to adjust a joining position between the first member held by the first holding unit and the second member held by the second holding unit. The second holding unit is of a circular plate shape, and the position adjustment mechanism includes four position-adjusting cam members disposed at equal intervals along an outer peripheral surface of the second holding unit, and moves the second holding unit in a horizontal direction.

Joining device and joining position adjustment method using joining device

A mounting method of sequentially mounting elements on a substrate includes a mounting process of mounting one element, which is taken out by a take-out part from an accommodating part in which the elements are accommodated, on a first contact region of the surface of the substrate where a liquid is coated. The method further includes a coating process of coating a liquid, by a coating part movably provided together with the take-out part, on a contact region of the surface of the substrate different from the first contact region when the one element is mounted on the first region.

Mounting method and mounting device

A bonding apparatus has an upper chuck and a lower chuck for holding wafers. The upper chuck is configured such that the center portion is bent to be convex when pressurized with a predetermined pressure. On the bottom surface of the lower chuck, there is an insulating ring formed of a combination of a plurality of insulating members to support the periphery of the lower chuck. The bottom surface of the insulating ring is supported by a support ring formed of a combination of a plurality of supporting members. The supporting members and the lower chuck are fixed by a bolt provided for each of the supporting members. The bolt is inserted through a through hole and a through hole which are formed in the insulating members and the supporting members, respectively, the through holes having a diameter larger than a diameter of the bolt.

Bonding apparatus and bonding method

There is provided a three-dimensional integrated circuit manufacturing method for temporarily attaching a chip to a transcription substrate, and securely detaching the chip from the transcription substrate when the chip is transferred to a supporting substrate. When a chip is temporarily attached to a transcription substrate, by evaporating a liquid existing between the chip and the transcription substrate, the solids of the chip and the transcription substrate can be attached to each other. Accordingly, the chip can be temporarily attached to the transcription substrate so as not to be deviated from its own position. Further, by setting adhesive strength between the chip and a supporting substrate to be higher than that between the chip and the transcription substrate, the chip can be securely detached from the transcription substrate when the chip is transferred from the transcription substrate to the supporting substrate.

Method and apparatus for manufacturing three-dimensional integrated circuit

A bonding apparatus includes a thermal treating unit and a bonding unit that are integrally bonded together. The thermal treating unit includes a first thermal treating plate for supporting and thermally processing a superimposed substrate. The bonding unit includes a second thermal treating plate for supporting and thermally processing the superimposed substrate processed in thermal treating unit, and a pressing mechanism for pressing the superimposed substrate against the second thermal treating plate. The first thermal treating plate includes a cooling mechanism for cooling the superimposed substrate placed on the first heating plate. Each unit can depressurize the internal atmosphere to a specified degree of vacuum. The thermal treating unit has a plurality of carrying mechanisms for conveying the wafers between the two units.

A bonding apparatus for bonding substrates having metal bonding portions, includes: a processing container having an opening formed on the bottom of the processing container; a thermal treating plate disposed within the processing container, the thermal treating plate allowing for substrates to be mounted thereon and allowing for thermal treatment of the substrates; a pressing mechanism disposed within the processing container opposite the thermal treating plate and which presses the substrates to the thermal treating plate; an annular supporter which is disposed in an inner side of the processing container along the opening of the processing container, the annular supporter providing an airtight seal between the processing container and the thermal treating plate, and supporting the thermal treating plate; and a cooling mechanism which is disposed in an inner side of the supporter below the thermal treating plate, the cooling mechanism cooling the thermal treating plate.

Bonding apparatus

A prober which tests an object to be tested under temperature control is provided. This prober includes a stage base, Z stage, X-Y stage having a frame structure, substrate fixing mechanism arranged on the X-Y stage, a probe card arranged to oppose the substrate fixing mechanism, and a probing stage fixed on the Z stage and arranged in the frame structure of the X-Y stage such that its axis coincides with an extension line vertically extending from the probe center of the probe card. The probing stage includes a probing elevating mechanism, and a temperature controller to heat and cool the object to be tested. The probing stage supports the substrate of the object to be tested from the bottom surface, and controls the temperature of the object to be tested.

Prober and probe testing method for temperature-controlling object to be tested

A prober including a probe card, a main chuck, a spacer, a conveying mechanism, and a supporting portion. The probe card is provided on an upper surface of a main body of the prober. The main chuck is provided in the main body of the prober, underneath the probe card, to be movable in X, Y, Z and .theta. directions. The spacer has an upper portion on which a cleaner tool for the probe card is held. The conveying mechanism for conveying the spacer between outside of the main body of the prober and a position on the main chuck. The supporting portion is provided on an outer side surface of the main chuck, for supporting the spacer. The main chuck is moved up and down directly underneath the probe card such that probes of the probe card is cleaned with the cleaner tool on the spacer held on the main chuck.

Prober and method for cleaning probes provided therein

Wafer prober

An electric probing-test machine comprises a probe card having a plurality of probes contacted with chips of a semiconductor wafer and serving to apply test signal to a tester which judges whether circuits on the chips of the wafer are correct or deficient, a main chuck for holding the wafer at a test temperature, a system for cooling the main chuck, and a controller for controlling the cooling system. The main chuck includes a chuck top contacted directly with the wafer, a jacket arranged to conduct heat exchange relative to the chuck top, and a temperature sensor for detecting the temperature of the chuck top. The cooling system has a pump for supplying a coolant from a reservoir to the jacket. Responsive to temperature information detected by the temperature sensor, the amount of the coolant supplied from the reservoir to the jacket is controlled by the controller to thereby control the temperature of the chuck top.

Electric probing-test machine having a cooling system

A method of magnetizing a rotor of a motor including the rotor made of an integrated magnet member and a stator is provided. Predetermined magnetic fields are preliminarily applied to the rotor to form magnetic paths and thereafter, the rotor is demagnetized. Then, the rotor is assembled into the stator. The rotor and stator are positioned such that the directions of the magnetic fields which are generated from the stator winding of the stator coincide with the directions of the magnetic paths of the rotor. Subsequently, in the state in which both of the rotor and stator are positioned, a current is supplied to the stator winding and the magnetic fields are generated, thereby magnetizing the rotor by the magnetic fields.

Method of magnetizing rotor of motor

A horizontal type rotary compressor comprising radial partitioning walls in a discharge silencer. A slant portion is formed in the partitioning walls thereby enabling the oil within the discharge silencer to be discharged to the outside of the silencer. Thus, a noise generation due to a cavity resonance in the discharge silencer and an impact noise of a discharge valve in the oil may be prevented. At the same time, a carbonization of the oil, caused by an increase of the oil temperature, may also be prevented.

Horizontal type rotary compressor

A rotary compressor has a main bearing and a sub-bearing which are disposed on both sides of a cylinder, and a vane which is inserted at an eccentric crank pin portion of a crankshaft and is adapted to reciprocate while being in contact at one end thereof with a roller eccentrically rotating inside the cylinder. An oil feeding mechanism for the rotary compressor comprises: an oil feeding hole provided in a portion of the crankshaft closer to the end surface of a sub-journal of the crankshaft; an oil hole provided in a crank pin portion of the crankshaft such as to communicate with both the oil feeding hole and an oil groove formed on the crank pin portion; a spiral oil groove formed in the outer periphery of a main journal of the crankshaft such as to spiral in the direction opposite to the rotational direction of the crankshaft; and a spiral oil groove formed in the outer periphery of the sub-journal of the crankshaft such as to spiral in the same direction as the rotational direction of the crankshaft.

Growing community of inventors

Nirasaki, Japan

Masahiko Sugiyama