Nec Corporation

Nec Corporatioin

Masahiko Sano

Naoki Oda

Takao Yamazaki

Seiji Kurashina

Yoshimichi Sogawa

Junshiro Motoyama

Yuji Akimoto

Tokuhito Sasaki

Satosi Baba

Keiji Miyamoto

The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole.

Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package

A vacuum package has a chamber in which pressure is reduced to less than the atmospheric pressure, a functional component sealed in the chamber, and a material forming at least a part of the chamber. The material has at least one through hole to evacuate the chamber. In a cross section perpendicular to the material taken along the through hole, an edge portion of the material forming the through hole has an obtuse angle. The through hole is sealed with a sealing material.

Vacuum package and manufacturing process thereof

An infrared absorption film (first through third infrared absorption films) that constitutes a photoreceptor of a thermal-type infrared detection element comprises a laminate film in which a film composed of a novel SiCO material having high absorption on the short-wavelength end (approximately 8 to 10 &#x3bc;m) of the waveband (atmospheric window) from 8 to 14 &#x3bc;m is combined with a film composed of SiO, SiN, SiC, SiON, SiCN, or another material having high absorption on the long-wavelength end (approximately 10 to 14 &#x3bc;m) of the abovementioned waveband. Infrared rays on the short-wavelength end that could not be effectively utilized by the conventional thermal infrared detection element can thereby be absorbed by the SiCO membrane, infrared rays throughout the abovementioned waveband can be effectively utilized, and the sensitivity of the thermal infrared detection element can be enhanced.

Thermal-type infrared detection element

In order to achieve an aspect of the present invention, a rear vehicle detecting apparatus of a vehicle include an alarm unit, a temperature detecting section, a reference temperature data generating section, a comparing section, and a drive section. The temperature detecting section detects a first temperature data based on heat radiated from another vehicle which exists behind the vehicle. The reference temperature data generating section generates a second temperature data as a reference. The comparing section compares the first temperature data and the second temperature data. The driving section drives the alarm unit based on the comparing result by the comparing section.

Vehicle with rear vehicle detecting apparatus

A background heat source unit 4 having a plurality of heat sources, which are arranged substantially at a fixed interval and set to a temperature different from the body temperature of passenger and also from the ambient temperature, and an infrared sensor 7, are disposed such that they face each other via a passenger. Whether a passenger is present is checked according to the result of a check, made by comparing a detected temperature pattern of the background heat source unit 4, detected by the infrared sensor 7, and a reference temperature pattern of the background heat source unit 4, preliminarily stored in a control circuit 17, as to whether a non-identical area is present in the compared temperature patterns.

Passenger sensing system

A semiconductor crystal infrared detecting portion structure is provided in a photoconductive infrared detector and is provided at opposite ends with first and second electrodes so biased that the first and second electrodes have a positive potential and a ground potential respectively. The semiconductor crystal infrared detecting portion structure has an infrared receiving part so that the semiconductor crystal infrared detecting portion structure comprises a first half region defined between the infrared receiving part and the first electrode and a second half region defined between the infrared receiving part and the second electrode. At least the second half region reduces in section area toward the second electrode to increase a resistance of at least the second half region.

Growing community of inventors

Tokyo, Japan

Masahiko Sano