Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Hitachi Koki Co., Ltd.

Masahiko Sakai

Toshikazu Narahara

Kazuo Goto

Shinichi Toyoda

Ren Itoh

Akemi Sagawa

Hitoshi Yokono

Shunichi Numata

Toru Koyama

Junji Mukai

Yoshiharu Karasawa

Tomoya Tsunoda

Takeshi Hakamada

Kenichi Saida

Riyuuichi Shimizu

Michio Ebata

There is disclosed a hot melt type ink for an ink jet which has a small rate of a volume change accompanied with a phase change from a melt status to a solid matter and does not cause an offset and which provides a clear color image on an OHP sheet. The above ink composition has a volume change rate falling in a range of less than 10%, preferably 8 to 4% and a phase change temperature range of 60.degree. C. to the jetting temperature.

Hot melt type ink composition for ink jet

A hot-melt ink composition for an ink jet printer comprising from 10 to 65% by weight of a polyamide resin, from 5 to 60% by weight of a fatty acid amide, from 5 to 40% by weight of a glyceride, and up to 5% by weight of a colorant. The composition is excellent in transparency to provide a highly transparent ink image on an OHP sheet.

Hot-melt ink composition

Electric windings comprising an electric conductor and a plurality of cured insulating layers wrapping around the conductor, said cured insulating layers being obtained by bonding two or more insulating materials with a binder solution containing a mixture of a condensation polymerization type silicone resin containing hydroxyl groups in the molecule and an addition polymerization type silicone resin to form a composite insulating material, wrapping the composite insulating material around the conductor, impregnating the wrapped composite insulating material with an impregnating varnish of an epoxy-isocyanate resin and curing the impregnated composite insulating material, have excellent water resistance in addition to excellent thermal resistance, and mechanical properties.

Electric windings and production thereof characterized by the use of a

Electric machine windings produced by wrapping a composite insulating material around an electrical conductor, said composite insulating material having been prepared by bonding two or more insulating materials with a silicone resin containing hydroxyl groups in the molecular structure, impregnating said composite insulating material with an insulating varnish comprising 1 equivalent of a polyfunctional epoxy compound and 2.5 to 25 equivalents of a polyfunctional isocyanate compound and curing said varnish, have excellent insulation properties under high temperatures and high humidity and thermal resistance of class H or more.

Process for producing electric windings

A thermosetting resin composition comprising a polyfunctional epoxy compound such as diglycidyl ether of bisphenol A, a polyfunctional isocyanate such as diphenylmethane diisocyanate, a curing agent and a polybutadiene type homopolymer having terminal hydroxyl groups or copolymer having terminal amino groups, or a reaction product of a polyfunctional epoxy compound or an epoxy compound having halogen atom(s) and a polybutadiene type homopolymer or copolymer having terminal hydroxyl groups or terminal carboxyl groups can produce cured articles excellent in heat resistance, crack resistance and fire resistance.

Thermosetting resin composition

A thermosetting resin composition comprising a polyfunctional epoxy compound such as diglycidyl ether of bisphenol A, a polyfunctional isocyanate such as diphenylmethane diisocyanate, a curing agent and polybutadiene type polymer having terminal hydroxyl groups can produce cured articles excellent in heat resistance and crack resistance.

In an epoxy resin composition comprising an alicyclic epoxy resin, a curing agent having phenolic hydroxyl group in its molecule and an imidazole curing accelerator, excellent thermal resistance and excellent mechanical properties can be given to the cured epoxy resin composition by blending 100 parts by weight of 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane as the alicyclic epoxy resin, 25 to 50 parts by weight of a phenol-formaldehyde condensate as the curing agent having phenolic hydroxyl group in its molecule and 0.1 to 15 parts by weight of at least one imidazole compound selected from the group consisting of 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenyl-4-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-methyl-4-ethylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-azine-2-methylimidazole, 1-azine-2-undecylimidazole and 1-azine-2-ethyl-4-methylimidazole as the imidazole curing accelerator.

Epoxy resin compositions

Thermosetting resin compositions are obtained by mixing a resinous addition product produced by reacting an isocyanate compound having a molecular weight of 100 to 2000 and containing at least two isocyanate groups in its molecule with an epoxyphenol compound represented by the formula, ##EQU1## wherein R is a bi- or more valent group containing phenyl, R.sub.1 is hydrogen, methyl or ethyl, m and n each are an integer of 1-8, and optionally an ordinary thermosetting epoxy resin, and 0.01 to 10 % by weight of a basic heterocycle forming catalyst based on the weight of said resinous addition product, said isocyanate compound and said epoxyphenol compound being blended so that said OH group may be present in an amount of 1/3 to 1 equivalent per equivalent of said isocyanate group and said epoxy group may be present in an amount of one-fifth to two-thirds equivalent per equivalent of said isocyanate group. The said addition product can be converted into a stable B-stage and is particularly useful as a varnish for prepreg.

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Hitachi, Japan

Masahiko Sakai