Kabushiki Kaisha Toshiba

National Institute of Advanced Industrial Science and Technology

Toshiba Tec Kabushiki Kaisha

Other

Shin-etsu Chemical Co., Ltd.

Kanazawa University

Tokyo Shibaura Denki Kabushiki Kaisha

Denso Corporation

Nissan Motor Company Limited

Industrial Science and Technology

National Institute of Advanced

National University Corporation Kanazawa University

Masahiko Ogura

Osamu Takagi

Satoshi Kinouchi

Kazuhiko Kikuchi

Hiroshi Nakayama

Kenji Takano

Taizo Kimoto

Hisaaki Kawano

Noriyuki Umezawa

Toshiharu Makino

Satoshi Yamasaki

Hiromitsu Kato

Daisuke Takeuchi

Norio Tokuda

Hitoshi Noguchi

Hideyo Okushi

Takao Inokuma

Tsubasa Matsumoto

Hiroyuki Kawashima

Junji Watanabe

Shozo Shirai

Daisuke Kuwabara

Naoto Kobayashi

Tatsuyuki Miura

Masataka Hasegawa

Hideyuki Watanabe

Kazuhiro Ikemori

Hideyo Ookushi

Sadanori Yamanaka

Mutsuko Hatano

Satoshi Tanimoto

Hideshi Oushiden

Yasufumi Tanimoto

Kazuhiro Oyama

Takayuki Iwasaki

Masashi Honda

Norihiko Kiritani

Koji Kajimura

Takahiko Adachi

Noiryuki Umezawa

Takuma Minamiyama

Sung-Gi Ri

The present invention provides a novel semiconductor device for high breakdown voltage having no drift layer. The semiconductor device includes a first semiconductor layer of a first conductivity type which is either a p-type or an n-type conductivity type, a source portion arranged so as to be in contact with the first semiconductor layer and configured as a semiconductor portion of a second conductivity type different from the first conductivity type, a source electrode arranged in ohmic contact with the source portion, a gate electrode arranged on at least one selected from surfaces of the first semiconductor layer via a gate insulating film interposed therebetween and capable of forming by an applied electric field, an inversion layer in a region of the first semiconductor layer near the surface of the first semiconductor layer contacting the gate insulating film, a second semiconductor layer of the first conductivity type arranged so as to be in contact with the inversion layer, and a drain electrode separated from the inversion layer and arranged in Schottky contact with the second semiconductor layer.

Semiconductor device

It is an object to provide a method for producing a diamond substrate effective for reducing various defects including dislocation defects and a foundation substrate used for the same. This object is achieved by a foundation substrate for forming a diamond film by a chemical vapor deposition method, wherein an off angle is provided to the surface of the foundation substrate with respect to a predetermined crystal plane orientation.

Foundation substrate for producing diamond film and method for producing diamond substrate using same

A method for manufacturing a diamond substrate, including: a first step of preparing patterned diamond on a foundation surface, a second step of growing diamond from the patterned diamond prepared in the first step to form the diamond in a pattern gap of the patterned diamond prepared in the first step, a third step of removing the patterned diamond prepared in the first step to form a patterned diamond composed of the diamond formed in the second step, and a fourth step of growing diamond from the patterned diamond formed in the third step to form the diamond in a pattern gap of the patterned diamond formed in the third step. There can be provided a method for manufacturing a diamond substrate which can sufficiently suppress dislocation defects, a high-quality diamond substrate, and a freestanding diamond substrate.

Diamond substrate and freestanding diamond substrate

Method for manufacturing diamond substrate

The present invention provides a method for manufacturing a diamond substrate, including: a first step of preparing patterned diamond on a foundation surface, a second step of removing a foreign substance adhered on a wall of the patterned diamond prepared in the first step, and a third step of growing diamond from the patterned diamond prepared in the first step to form the diamond in a pattern gap of the patterned diamond prepared in the first step. There can be provided a method for manufacturing a diamond substrate with few dislocation defects, in which generation of abnormal growth particles are suppressed.

A method for manufacturing a single crystal diamond in which vapor phase synthetic single crystal diamond is additionally deposited on a single crystal diamond seed substrate obtained by vapor phase synthesis, includes a step of measuring flatness of the seed substrate, a step of determining whether or not to flatten the seed substrate based on the measurement result of the flatness, and any one of the following two steps of a step of additionally depositing the vapor phase synthetic single crystal diamond after flattening the seed substrate for which the flattening is necessary based on the determination and a step of additionally depositing the vapor phase synthetic single crystal diamond without flattening the seed substrate for which the flattening is not necessary based on the determination.

Method for manufacturing a single crystal diamond

A semiconductor device includes a MISFET having: a diamond substrate; a drift layer having a first layer with a first density for providing a hopping conduction and a second layer with a second density lower than the first density, and having a &#x3b4; dope structure; a body layer on the drift layer; a source region in an upper portion of the body layer; a gate insulation film on a surface of the body layer; a gate electrode on a surface of the gate insulation film; a first electrode electrically connected to the source region and a channel region; and a second electrode electrically connected to the diamond substrate. The MISFET flows current in the drift layer in a vertical direction, and the current flows between the first electrode and the second electrode.

Semiconductor device using diamond

A white light-emitting device of the present invention includes a substrate (); a diamond semiconductor layer () provided on the substrate (), in which one or a plurality of p-type &#x3b1; layers (), a p-type or n-type &#x3b3; layer (), and one or a plurality of n-type &#x3b2; layers () are laminated in this order from the substrate (); a first electrode () provided on the &#x3b1; layer () which injects an electric current; a second electrode () provided on the &#x3b2; layer () which injects an electric current; and a fluorescent member () which coats a light emission extraction region of the surface of the diamond semiconductor layer.

White light-emitting element

The present invention provides a diamond semiconductor device which includes: a diamond substrate; a diamond step section disposed over substrate surface of the diamond substrate having a {001} crystal face to rise substantially perpendicularly to substrate surface; an n-type phosphorus-doped diamond region; and a diamond insulation region. In the diamond step section, a first step section having a {110} crystal face over a side surface is integrated with a second step section having a {100} crystal face over a side surface. The phosphorus-doped diamond region is formed by crystal growth started from base angle of the step shape of the first step section over the side surface of the first step section and substrate surface of the diamond substrate as growth base planes. The diamond insulation region is formed by crystal growth over the side surface of the second step section and substrate surface of the diamond substrate as growth base planes.

Diamond semiconductor device and method for manufacturing same

In this junction element, when a forward voltage is applied, a depletion layer is formed in a semiconductor layer, prohibiting electrons present in an electrode layerto move into the semiconductor layer. For this reason, a majority of holes in a semiconductor layerdo not disappear by recombination with conduction electrons in the semiconductor layer, but reach the electrode layerwhile diffusing into the semiconductor layer. Accordingly, the junction elementcan serve as a good conductor for holes, while avoiding the influence of a resistance value, and allows a current to flow therethrough at a level equal to or more than that achieved by a semiconductor element formed of a Si or SiC semiconductor. The present invention is applicable to any semiconductor material in which at least one of a donor level and an acceptor level is located at a sufficiently deep position beyond a thermal excitation energy at an operating temperature, such as diamond, zinc oxide (ZnO), aluminum nitride (AlN), or boron nitride (BN). The present invention is also applicable to even a material having a shallow impurity level at room temperature, such as silicon (Si), silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs), or germanium (Ge), as long as operation is performed at such a low temperature that the thermal excitation energy can be sufficiently small.

The present invention is contemplated for providing a diamond semiconductor device where an impurity-doped diamond semiconductor is buried in a selected area, and a method of manufacturing the same. That is, a diamond semiconductor device having an impurity-doped diamond area selectively buried in a recessed portion formed in a diamond substrate; and a method of manufacturing a diamond semiconductor device, including the steps of selectively forming an recessed portion on the {100}-facet diamond semiconductor substrate, wherein the bottom face of the recessed portion is surrounded by the {100} facet and the side face of the recessed portion is surrounded by the {110} facet, and forming an impurity-doped diamond area by epitaxially growing diamond in the &#x3c;111&#x3e; direction while doping with impurities and burying the recessed portion.

Diamond semiconductor device and method of manufacturing the same

Provided is a light emitting device formed of an indirect transition semiconductor configured from a semiconductor material having high exciton binding energy, wherein an active layer of the indirect transition semiconductor or an active region by a pn junction is formed, the light emitting device has an electrode for injecting current into the active layer or the active region, and the internal quantum efficiency is 10% or more.

High efficiency indirect transition semiconductor ultraviolet light emitting device

The present invention provides a fixing device and a digital photocopier which can shorten the time from an instruction of starting image formation to end of fixing. The fixing device is provided in a cylinder made of metal and having a small thickness, and includes a magnetic excitation coil. When the power source is turned on, all the electric power defined by subtracting an electric power amount consumed by components other than the fixing device is supplied to the magnetic excitation coil to perform heating. As the structural components of the photocopier and auxiliary devices added to the photocopier operate, the electric power defined by subtracting, from the maximum input electric power, the electric power consumed by the structural components of the photocopier and the auxiliary devices is supplied to perform heating. In this manner, the heat roller of the fixing device is heated, in a short time, to a temperature which enables fixing, so that the time required for first copying can be shortened.

Image forming apparatus and fixing device

An electrophotographic fixing device allowing a flow of an AC current through an electromagnetic induction coil arranged close to a heating roller having a metal layer formed of a conductor and allowing the heat generation of the heating roller to heat a to-be-fixed member, in which the fixing device comprises a circuit board for outputting the AC current from an output terminal and passing the current through the electromagnetic induction coil, a conductive plate metal having one end side fixed by a fastening screw to the output terminal of the circuit board, a male-side connection terminal provided on the other end of the plate metal, and a female-side connection terminal provided at an end of a leader line of the electromagnetic induction coil and detachably connected to a male-side connection terminal.

Fixing device that is detachable from an image forming apparatus

Fixing device

Growing community of inventors

Yokohama, Japan

Masahiko Ogura