Kabushiki Kaisha Toshiba

Masahiko Nozaki

Junichi Hosokawa

Takeshi Nakano

Yuji Miyashita

Yuki Koguchi

Shinichi Ohsawa

According to one embodiment, a solid-state imaging device includes a signal level comparing circuit. The signal level comparing circuit compares the levels among the signals of first peripheral pixels, the levels among the signals of second peripheral pixels, the levels among the signals of third peripheral pixels. The first peripheral pixels are arranged with the pixels for colors other than the color for the target pixel interposed between the first peripheral pixels and the target pixel. The second peripheral pixels are disposed on extension lines in directions from the target pixel to the first peripheral pixels, and the third peripheral pixels are disposed between the second peripheral pixels.

Solid-state imaging device and camera module

According to the embodiment, a feedback clamp circuit is included, which increases or decreases a clamp parameter so that a black level approaches a target value while controlling a change amount of the clamp parameter, which sets the black level, based on the black level read out from OB pixels.

Image signal processing device and solid-state imaging device

According to one embodiment, a third optical black portion is arranged in parallel with a first optical black portion in a row direction and in parallel with a second optical black portion in column direction. At least one of the vertical line correction circuit and the horizontal line correction circuit adds/subtracts arithmetic average of the third black level signal generated by the third optical black portion.

Growing community of inventors

Kanagawa, Japan

Masahiko Nozaki