Sumitomo Electric Printed Circuits, Inc.

Sumitomo Electric Fine Polymer, Inc.

Sumitomo Electric Industries, Limited

Power Gold LLC

Masahiko Kouchi

Makoto Nakabayashi

Tetsuya Shimomura

James Jen-Ho Wang

Kazuo Murata

Jin Joo Park

Tetsuya Shimakata

(1) A conductor layer is disposed on at least one surface of a dielectric layer, the dielectric layer including an intermediate layer and a pair or more of fluororesin layers disposed on both surfaces of the intermediate layer, in which the ratio of the total average thickness of the intermediate layer to the total average thickness of the fluororesin layers is 0.001 to 30, the relative dielectric constant of the intermediate layer is 1.2 to 10, the coefficient of linear expansion of the intermediate layer is &#x2212;1&#xd7;10/&#xb0; C. to 5&#xd7;10/&#xb0; C., and the adhesive strength between the fluororesin layer and the conductor layer is 300 g/cm or more. (2) Conductor layers are disposed on both surfaces of a dielectric layer made of a fluororesin, in which at least one of the conductor layers constitutes a wiring pattern, the average trace width of the wiring pattern is 25 to 300 &#x3bc;m, the average thickness of the dielectric layer in the region where traces of the wiring pattern are disposed is 5 to 125 &#x3bc;m, and the ratio of the average trace width to the average thickness of the dielectric layer is 2.4 to 30. (3) A multilayer structure includes conductor layers and dielectric layers made of a fluororesin alternately disposed, in which the fluororesin of the dielectric layers is crosslinked and chemically bonded to the conductor layers, the average thickness of the multilayer structure is 30 to 2,000 &#x3bc;m, and the crush resistance of the multilayer structure measured by a loop stiffness test is 0.1 to 20,000 N/cm.

Radio-frequency printed circuit board and wiring material

A printed circuit board according to an embodiment of the present invention includes, alternately, at least one insulating layer containing a synthetic resin as a main component; and a plurality of conductive layers including circuit patterns, wherein the plurality of circuit patterns of the plurality of conductive layers form a spiral pattern in plan view, and the plurality of circuit patterns are connected together via a plurality of through-holes so as to form a single closed loop in which a current flows counterclockwise or clockwise in an entirety of the spiral pattern. The conductive layers are preferably formed on both surfaces of the at least one insulating layer so as to form a pair. The spiral pattern includes a plurality of multi-row circuits arranged to form multi-rows, and a bridging circuit that connects an end portion of one multi-row circuit of one of the conductive layers to an end portion of another multi-row circuit of the other conductive layer, the other multi-row circuit being adjacent to the one multi-row circuit.

Printed circuit board, antenna, and wireless charging device

A flexible printed circuit board according to an embodiment of the present invention includes at least one insulating layer having flexibility and containing a synthetic resin as a main component; and at least one conducting layer including a circuit pattern, wherein the circuit pattern includes a continuous spiral pattern, and the flexible printed circuit board includes a curved portion that curves such that one side and another side of the spiral pattern are disposed close to each other.

Flexible printed circuit board, antenna, and wireless charging device

A flexible printed circuit assembly, having a first flexible printed circuit having a first conductive layer and a device that is connected the first conductive layer; and a second flexible printed circuit having a second conductive layer, an insulating center layer, and a third conductive layer, the insulating center layer arranged in-between the second and the third conductive layers, the second conductive layer and the insulating center layer being removed to form an opening to expose an upper surface of the third conductive layer, wherein the first flexible printed circuit is arranged such that the device is accommodated inside the opening, a lower surface of the device being in thermal connection with the third conductive layer, and the first conductive layer is arranged to be in electrical connection with the second conductive layer.

Method of embedding a pre-assembled unit including a device into a flexible printed circuit and corresponding assembly

A photoelectric hybrid substrate according to the present invention includes an insulating layer that contains a fluororesin as a main component, and conductor layers stacked on two surfaces of the insulating layer. The photoelectric hybrid substrate includes an optical communication mechanism configured to propagate an optical signal in the insulating layer by using reflection at inner surfaces of the conductor layers.

Growing community of inventors

Shiga, Japan

Masahiko Kouchi