Kabushiki Kaisha Toyota Jidoshokki

Masahiko Kawabe

Yoshitaka Iwata

Shogo Mori

Naoki Kato

Sergey Moiseev

Yuri Otobe

Hiroshi Yuguchi

A multilayer substrate includes a first metal plate forming a first coil; a second metal plate facing the first metal plate in a coil-winding axis direction and forming a second coil; a first insulating layer having therein the first metal plate; and a second insulating layer having therein the second metal plate. A metal foil is connected to the first metal plate through a plurality of via holes. An electronic component embedded in the first insulating layer is connected to a pattern formed on the metal foil.

Multilayer substrate

An electronic device includes a heat dissipation member, a power element that is thermally coupled to the heat dissipation member, and a first conductive layer to which the power element is electrically coupled. The electronic device further includes a control element that controls a switching operation of the power element, a second conductive layer to which the control element is electrically coupled, and a resin layer arranged between the first conductive layer and the second conductive layer. The power element is embedded in the resin layer. The first conductive layer, the resin layer, and the second conductive layer are stacked on the heat dissipation member in this order from the ones closer to the heat dissipation member.

Electronic device

Growing community of inventors

Aichi-ken, Japan

Masahiko Kawabe