Fujitsu Corporation

Masahiko Ishiguri

Koichi Murata

Junichi Kasai

Masataka Mizukoshi

Eiji Watanabe

Mitsutaka Sato

Akira Takashima

Michio Sono

Tetsuya Fujisawa

Shuichi Chiba

Hiroshi Yoshimura

Katsuhiro Hayashida

Hirohisa Matsuki

Naoyuki Watanabe

Masamitsu Ikumo

Yutaka Makino

Tadahiro Okamoto

Hiroyuki Yoda

Kosuke Otokita

Michiaki Tamagawa

Akira Satoh

Yasushi Toida

Kazuhiro Misawa

Keiichi Sasamura

Kousuke Otokita

The storage body includes a tape formed with recess portions that dip in in a thickness direction formed at intervals along the tape length direction and a cover that is superimposed on the tape and closes off openings of the recess portions. The tape is fixed to the tape by intermediate fixing portions and a pair of side fixing portions. The intermediate fixing portions are formed between the mutually adjacent recess portions. The pair of side fixing portions include overlapping portions and connect portions. The overlapping portions are formed at the two tape width direction sides of the intermediate fixing portions so as to overlap with the intermediate fixing portions along the tape length direction. The connect portions are formed with constant width connecting together the respective overlapping portions disposed in lines along the tape length direction.

Storage body and reel

A semiconductor device includes a substrate, a pad electrode formed on the substrate and a bump electrode formed on the pad electrode, wherein the pad electrode has an irregular flaw, and there is provided a pattern covering the irregular flaw between the pad electrode an the bump electrode.

Semiconductor device and manufacturing method thereof

A semiconductor device includes a semiconductor substrate and an array of protruding electrodes arranged at a pitch X. Each of the protruding electrodes has a height Xand is formed on a barrier metal base of diameter Xcoupled to an electrode arranged on the semiconductor substrate so as to satisfy the relations (X/2)&#x2266;X(3*X/4) and (X/2)&#x2266;X(3*X/4).

Semiconductor device and method of fabricating the same

There is provided a semiconductor device which comprises electrode pads formed on an insulating film on a semiconductor substrate, an insulating cover film formed on the insulating film to have openings that expose the electrode pads, and a masking tape having a base material layer and a resist layer coated on the base material layer, and for covering an upper surface of the cover film and inner surfaces of the openings in a situation that the resist layer is directed toward a semiconductor substrate side. Accordingly, it is possible to improve a throughput in a series of steps of grinding/polishing the semiconductor substrate and forming the bump electrodes which are required to thin the substrate of the semiconductor device.

Semiconductor device as an object of thickness reduction

A semiconductor device includes a semiconductor element, a package sealing the semiconductor element, and leads for passing signals between the semiconductor element and an external device. Each of the leads has an inner-lead part sealed within the package and connected with the semiconductor element, and an outer-lead part which extends outward from the package toward a top of the package, and is to be connected to the external device. The outer-lead part includes a first-port part at a lower side of the package, and a second-port part at an upper side of the package.

Semiconductor device and semiconductor device unit for a stack

A semiconductor device including a semiconductor element, and leads connected with the semiconductor element. Each of the leads includes an outer lead part for being connected externally. The semiconductor device further includes a plastic package sealing the semiconductor element and the leads. In the semiconductor device, the outer lead part is exposed to the outside of a side face of the plastic package, and the plastic package is mounted on any base in a standing form by the side face contacting the base.

Semiconductor device having an inner lead extending over a central

Growing community of inventors

Kawasaki, Japan

Masahiko Ishiguri