Eagle Industry Co., Ltd.

Eagleburgmann Japan Co., Ltd.

Nec Electronics Corporation

Fuji Jukogyo Kabushiki Kaisha

Masahiko Inoue

Hidekazu Takahashi

Hiroyuki Ochiai

Hiroshi Ikeda

Toshio Masuda

Atsushi Atake

An accordion-structured welded bellows for a semiconductor-manufacturing device is characterized in that a plurality of annular bellows plates having curved surfaces in a radial direction are connected in an alternating fashion on the outside-diameter side and the inside-diameter side, wherein the annular bellows plates have a processing-side bellows plate and a non-processing-side bellows plate, a gas layer is interposed between the two bellows plates, the processing-side bellows plate is configured as a thick plate, and the non-processing-side bellows plate is configured as a thin plate. The welded bellows is less likely to be damaged by foreign matter and to be able to use the non-processing-side bellows plate to compensate for any damage to the processing-side bellows plate.

Welded bellows for semiconductor manufacturing device

A semiconductor fabrication device welded bellows of an accordion structure is characterized in that a plurality of annular bellows plates having faces curving in a radial direction are connected alternatingly at the outside diameter side and inside diameter side, wherein the annular bellows plates are provided with a treatment-side bellows plate and a non-treatment-side bellows plate, a gas layer disposed between the two bellows plates, the treatment-side bellows plate being of lesser thickness, and the non-treatment-side bellows plate being of greater thickness. The bellows are highly resistant to damage caused by foreign matter; or, in the unlikely case that the treatment-side bellows plate becomes damaged, the damage can be compensated for by the non-treatment side bellows plate.

Semiconductor fabrication device welded bellows

A luggage storage structure for an automobile includes: a storage concave portion formed so as to project downward on a floor panel and capable of storing luggage, a plate member for approximately closing an upper part of the storage concave portion, and a transfer mechanism for transferring the plate member approximately up and down in an upper part of the floor panel. The luggage structure is securely protected by the plate member and the transfer mechanism.

Luggage storage structure for automobile and lifter

A bump inspecting apparatus lights a spherical solder bump mounted on the surface of a circuit board and has a reinforcing resin applied to the lower half thereof from all circumferential directions with rays of light which intersect at a predetermined angle. An image of the lighted solder bump is captured while the amount of light irradiated upon the central portion of a solder bump is reduced. An object is extracted from image data obtained by the image capture and the area and/or the aspect ratio of the object are confirmed. The quality of the state of the reinforcing resin applied to the solder bump can be inspected.

Growing community of inventors

Tokyo, Japan

Masahiko Inoue