Denso Corporation

Denso Corportion

Masahiko Imoto

Tatsuya Watanabe

Shinichi Awano

Yoshinari Goshima

Hideyuki Iiboshi

A metal wiring plate includes a soldering portion to which an electronic device is soldered and a wiring portion extending from the soldering portion and configured to electrically connect the electronic device to other device. The wiring portion includes a narrow portion located adjacent to the soldering portion. The width of the narrow portion is less than the width of the soldering portion so that the narrow portion helps prevent melted solder applied to the soldering portion from spreading to areas outside the soldering portion. The narrow portion allows the electronic apparatus to be surely soldered to the soldering portion without using solder resist.

Metal wiring plate

A resin leak detector includes a pressure sensor element and a leak determination unit. The pressure sensor element detects a pressure in a case cavity. That is, when resin leaks into a space between an upper circuit case and a lower circuit case, the pressure in the case cavity decreases temporarily. The decrease of the pressure in the case cavity is detected by the pressure sensor element based on comparison between a detected pressure and a predetermined lower limit. The resin leak into the upper and lower circuit case is detected without cutting an outer case of an electronic device such as an acceleration sensor or the like.

Apparatus and method for detecting resin leak

In a method of manufacturing an electronic device, an electronic element is disposed on a wiring plate that is electrically coupled with a connector terminal, a first surface of the wiring plate is covered with a first casing element and a second surface of the wiring plate is covered with a second casing element to form an electronic circuit part, the electronic circuit part is disposed in a case cavity of a molding tool, and a resin is filled into the case cavity to form the resin-molded case while keeping a state where a first pressure that pushes the first casing element toward the wiring plate and that changes with time is substantially equal to a second pressure that pushes the second casing element toward the wiring plate and that changes with time.

Method of manufacturing electronic device having resin-molded case and molding tool for forming resin-molded case

A semiconductor device includes: a semiconductor chip; a package for accommodating the chip, wherein the package has a box shape with an opening and a bottom; and a cover for sealing the opening of the package. The semiconductor chip is disposed on the bottom of the package. The cover has a plate shape. The cover includes a protrusion, which is disposed at a center of the plate shape. The protrusion protrudes toward an outside of the package.

Physical quantity sensor and semiconductor device having package and cover

A collision impact detector detects deceleration of a vehicle caused by its collision with another vehicle or an obstacle. A rotor is rotatably supported on a shaft and biased by a coil spring in a direction opposite to a rotational direction in which the rotor is rotated by the deceleration. One axial end of the coil spring is supported by a first support integrally formed with the rotor, and the other axial end of the coil spring is supported by a second support formed separately from the rotor. In this manner, a friction torque generated between the coil spring and the second support is eliminated, thereby considerably reducing a total friction torque associated with rotation of the rotor. The second support may be formed either integrally with or separately from a housing supporting the shaft.

Collision impact detector for use in automotive vehicle

A deceleration impact detector for detecting a vehicle collision or the like is composed of a rotor having an eccentric gravity center, a spring biasing the rotor to its initial position, a cam connected to rotor, and a pair of contacts consisting of a movable contact and a stationary contact. The rotor rotates together with the cam when a deceleration exceeding a predetermined level is imposed on the rotor. The pair of contacts are closed by the cam thereby to generate an electrical signal to inflate an air-bag. The movable contact is made of a resilient leaf spring, while the stationary contact is made of a plate having a high rigidity, so that resonant vibrations of the stationary contact otherwise caused by a high deceleration impact are avoided.

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Kariya, Japan

Masahiko Imoto