Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Senju Metal Industry Co., Ltd.

Other

Panasonic Intellectual Property Management Co., Ltd.

Masahiko Hirata

Toshihiko Taguchi

Hisahiko Yoshida

Takashi Nagashima

Kunihito Takaura

Yoshitaka Toyoda

Motonari Ogura

Yasuo Yokota

Hiroji Noguchi

Shinji Yoshida

Kazuhiro Hayashi

Tsukasa Ohnishi

Takao Hisazumi

Akihisa Yamada

Tetsuhiko Isobe

Keiichi Zaitsu

Mamoru Senna

Yoshihiro Kawasaki

Suguru Matsumura

Masanobu Okuyama

Setsuko Tadokoro

Takashi Ohashi

Ichiro Takahara

Ryozo Sato

A surface light source apparatus includes an end face for taking in light emitted from a light source and a main surface for emitting the light. The surface light source apparatus further includes a plurality of structure bodies formed on an opposed surface disposed opposite to the main surface in the surface light source apparatus, each of which has a reflecting surface facing the point light source. Each structure body has a cut-off portion which removes a portion on the reflecting surface in a longitudinal direction of the structure body and in a height direction.

Surface light source apparatus having cut out portions where a reflecting portion is not present

A centrifugal fan device includes a diverting member the height of which is lower than the height of an interior wall surface of a casing. The diverting member diverts the air flowing to an air outlet into a centrifugal fan side and a side wall side of the diverting member and also diverts the air flowing to the air outlet into a first cover side and a second cover side of the diverting member. As a result, the amount of air blown from the air outlet is dispersed uniformly over the entire area of the air outlet, and a deviation in the amount of air blown out of the air outlet is reduced.

Centrifugal fan device and eletronic device having the same

Electric circuit board

In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn&#x2014;Zn based alloy and at least one powder of a Sn&#x2014;Ag based alloy. The alloys powders are blended so that the composition of the powder mixture is 5-10 mass % of Zn; 0.005-1.5 mass % of Ag; optionally at least one of 0.002-1.0 mass % of Cu, 0.005-15 mass % of Bi, 0.005-15 mass % of In, and 0.005-1.0 mass % of Sb; and a remainder of Sn.

Solder paste and printed circuit board

The present invention provides a Sn&#x2014;Zn based lead-free solder which can prevent peeling of solder from soldered portions even after the passage of long periods after soldering of portions to be soldered made of Cu. A Sn&#x2014;Zn based lead-free solder according to the present invention comprises 5-10 mass percent of Zn, a total of 0.005-1.0 mass percent of at least one substance selected from the group consisting of Au, Pt, Pd, Fe, and Sb, optionally a total of at most 15 mass percent of at least one substance selected from the group consisting of Bi and In, and a remainder of Sn. This Sn&#x2014;Zn based lead-free solder can be made into a solder paste using a rosin flux containing a halide such as an amine hydrochloride as an activator.

Lead-free solder and soldered article

Bladed wheel for a centrifuge air blower

A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5-10.0 wt % of isocyanuric acid or a haloalkyl ester thereof is added can prevent the formation of solder balls and voids during reflow soldering and exhibit good solderability. A solder paste comprising a powder of an Ag- or Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.01-10.0 wt % of a salicylamide compound also does not exhibit a change in viscosity and exhibits good solderability.

Solder paste

A small cooling fan includes a rotating fan body with a vane in a flat fan housing, and an air channel for backflow prevention. The air channel is provided outside of the vicinity of the tip of the vane of the rotating fan body, extends to an air outlet, and has an inner height larger than that of a fan chamber. This structure can prevent the backflow of the wind at the air outlet and reduce the loss of the static pressure, thereby increasing the airflow quantity in spite of the small size.

Small cooling fan

A lead-free solder paste comprises an Sn&mdash;Zn based lead-free solder powder mixed with a flux. The flux contains at least one aromatic hydroxycarboxylic acid selected from the group consisting of aromatic carboxylic acids having one hydroxyl group in a meta position (such as 3-hydroxy-2-methylbenzoic acid) and aromatic carboxylic acids having at least two hydroxyl groups (such as dihydroxynaphthoic acid or dihydroxybenzoic acid) in an amount of 0.1-10.0 mass %. The flux may further include 0.5-20 mass % of an aliphatic hydroxy carboxylic acid (such as hydroxyoleic acid).

A solder paste having a powder of a Zn-containing solder alloy such as an Sn&mdash;Zn based alloy in admixture with a soldering flux such as a rosin flux is improved by adding from 0.1% to 5.0% by weight of a glycidyl ether compound such as alkyl, alkenyl, or aryl glycidyl ether. The improved solder paste has increased resistance to aging and to concomitant deterioration in solderability caused by reaction of Zn in the solder alloy with ingredients in the flux and has a substantially extended shelf life.

Lead-free zinc-containing solder paste

An organic acid salt is deposited on the surface of a solder powder containing Sn and Zn. Alternatively, 0.5 to 10 wt. % of a nonionic surfactant is added to a flux. By a method comprising such a procedure, provided are a lead-free solder powder and solder paste having good soldering characteristics wherein the reaction of an activating component with an alloy component in a flux is suppressed.

Solder powder and method for preparing the same and solder paste

In order to prevent aging of an Sn--Zn system alloy solder paste, 0.5-5% by weight of a compound obtained by adding an ethylene oxide to cyclohexylamine, preferably together with 0.5-5% by weight of a polyoxyethylene alkylamine is added to a flux of said solder paste.

Growing community of inventors

Kashiba, Japan

Masahiko Hirata