National Institutes for Quantum Science and Technology

Okazaki Manufacturing Company

Teikoku Ion Co., Ltd

Masahiko Hirakami

Ryosuke Nakamura

Masao Ishikawa

Takashi Nakamura

Masafumi Hojo

Takuya Kawawaki

Taketo Nishikawa

Mitsuhiko Terashita

Toshihiko Ryo

A plating apparatus () is disclosed including a plating tank (), cathodes (to), a holding mechanism (), at least one anode (), and a rotation mechanism (). The plating tank () contains an annularly or helically wound substrate () together with a plating solution. The cathodes (to) are placed inside the plating tank (). The holding mechanism () holds the cathodes (to) at positions electrically connected to the outer periphery of the substrate () and holds the substrate () via the cathodes (to). The anode () is placed at least on the inner periphery side of the substrate () held by the holding mechanism (). The rotation mechanism () rotates at least either the substrate () and cathodes (to) held by the holding mechanism () or the anode (), or both, around the axis of the wound substrate ().

Plating apparatus, plating method, and method for producing wire rod having the surface plated

Growing community of inventors

Higashiosaka, Japan

Masahiko Hirakami