Kyocera Corporation

Masahiko Higashi

Tetsuro Fujimoto

Noriaki Hamada

Kenichi Nagae

Yoshihiro Nakao

Kouichi Yamaguchi

Yasuhide Tami

Hideto Yonekura

Masanari Kokubu

Tetsurou Fujimoto

Youji Furukubo

Makoto Koi

Akihiro Hara

Norimitsu Fukami

Shinichi Suzuki

Takeshi Kubota

Yasuyoshi Kunimatsu

Hitoshi Kumatabara

Kenji Shimazu

Michio Shinozaki

Yohji Furukubo

Shuushin Inoue

A cell according to the present disclosure includes: a first electrode layer; a solid electrolyte layer on the first electrode layer, the solid electrolyte layer containing Zr; a middle layer on the solid electrolyte layer, the middle layer containing CeOwhich contains Ce and a rare earth element other than Ce; a second electrode layer on the middle layer; and a boundary region between the solid electrolyte layer and the middle layer, the boundary region including a basing point at which a molarity of Ce and a molarity of Zr are equal. An average molarity of the Ce within a range from the basing point up to 3 μm toward the solid electrolyte layer is equal to or less than 10 mol % with respect to a total of Ce, Zr, and other rare earth elements, an average molarity of Zr within the range is equal to or more than 70 mol % with respect to a total of Ce, Zr, and other rare earth elements, or a molarity ratio of Ce with respect to Zr within the range is equal to or less than 0.143.

Cell, cell stack device, module, and module housing device

A composite body includes a substrate containing Cr; and a first composite oxide layer disposed on at least a part of a surface of the substrate, the first composite oxide layer having a spinel type crystal structure, a first largest content and a second largest content among constituent elements excluding oxygen of the first composite oxide layer being Zn and Al in random order. Accordingly, the composite body can suppress diffusion of Cr from the substrate containing Cr to the first composite oxide layer, and has improved long-term reliability. A collector member and a gas tank, each of which is formed of the composite body, can have improved long-term reliability. A fuel cell device having excellent long-term reliability can be obtained using the collector member and the gas tank.

Composite body, collector member, gas tank, and fuel cell device

To provide a conductive member and a cell stack, where a concave groove of a conductive base substrate can be covered with a cover layer, as well as an electrochemical module and an electrochemical device.

Conductive member, cell stack, electrochemical module, and electrochemical device

A composite body in which the Cr diffusion can be sufficiently reduced and conductivity is good, a collector member, a fuel battery cell device, and a fuel battery device are provided. The composite body includes a substrate containing Cr, and a coating layer covering at least a part of the substrate, in which the coating layer includes a first layer containing Cr among constituent elements excluding oxygen, and including a chromium oxide crystal, a second layer disposed on the first layer, containing Zn, Al, and Cr among the constituent elements excluding oxygen, and including a spinel type crystal, a third layer disposed on the second layer, containing Zn and Mn among the constituent elements excluding oxygen, and including a spinel type crystal, and a fourth layer disposed on the third layer, containing Zn among the constituent elements excluding oxygen, and including a zinc oxide crystal.

Composite body, collector member, fuel battery cell device, and fuel battery device

A heat-resistant alloy capable of effectively suppressing diffusion of Cr, as well as an alloy member for a fuel cell, a fuel cell stack device, a fuel cell module and a fuel cell device are provided. A heat-resistant alloy includes a Cr-containing alloy, and a Cr-diffusion suppression layer located on at least a part of a surface of the Cr-containing alloy, the Cr-diffusion suppression layer being made by laminating a first layer that contains a Zn-containing oxide and a second layer that does not contain ZnO but contains an (La, Sr)MnO-based perovskite oxide in that order, so that it is possible to effectively suppress diffusion of Cr. By using the heat-resistant alloy for an alloy member for a fuel cell, a fuel cell stack device, a fuel cell module and a fuel cell device each having improved reliability can be obtained.

Heat-resistant alloy, alloy member for fuel cell, fuel cell stack device, fuel cell module, and fuel cell device

The present invention provides a heat-resistant alloy member which hardly causes external diffusion of Cr, an alloy member for a fuel cell, a collector member for a fuel cell, a cell stack, and a fuel cell apparatus. The surface of a collector base materialcontaining Cr is coated with a Cr diffusion preventing layermade of an oxide containing Zn and Mn and a coating layermade of an oxide containing Zn is formed on the surface of the Cr diffusion preventing layer. The coating layerpreferably contains at least one kind of Al and Fe as a trivalent or higher valent positive metal element.

Heat-resistant alloy member, alloy member for fuel cell, collector member for fuel cell, cell stack, and fuel cell apparatus

A ceramic wiring board provided with an insulating layer of a high dielectric constant formed of a ceramic sintered product having a high dielectric constants wherein the ceramic sintered product contains a crystal phase of lanthanum titanate and a glass phase present on the grain boundaries of the crystal phase, and has a coefficient of thermal expansion at 40 to 400&deg; C. of not smaller than 8&times;10 /&deg; C. and a specific inductive capacity at 1 MHz of not smaller than 10. The wiring board contains a capacitor and is very useful in realizing various electric circuit devices in small sizes, and can be further reliably mounted on a printed board that uses an organic resin as an insulating material.

Ceramic wiring board

A glass ceramic sintered product obtained by sintering a mixture powder containing a BaO-containing glass, metal oxide particles having a coefficient of linear thermal expansion at 40 to 400&deg; C. of not smaller than 6 ppm/&deg;C., and a Zr compound and, particularly, containing the Zr compound in an amount of from 0.1 to 30% by weight calculated as Zr0 , and exhibiting a coefficient of linear thermal expansion at 40 to 400&deg; C. of from 8.5 to 18 ppm/&deg;C. The glass ceramic sintered product exhibits excellent resistance against chemicals and does not discolor even when subjected to treatment with an acidic or alkaline solution in the step of plating. A wiring board using the glass ceramic sintered product as an insulating substrate exhibits a coefficient of linear thermal expansion substantially similar to that of an external circuit board, effectively suppressing the occurrence of thermal stress and cracking.

High-thermal-expansion glass ceramic sintered product

A structure for mounting a wiring board in which the wiring board including a ceramics insulating board, metallized wiring layers arranged on said insulating board, and a plurality of connection terminals mounted on said insulating board and electrically connected to said metallized wiring layer, is placed on a mother board having wiring conductors formed on the surface of an insulator which contains an organic resin, and the connection terminals of said wiring board are connected by brazing to the wiring conductors of said mother board, wherein a value F1 defined by the following formula (1):

Structure for mounting a wiring board

In a circuit board obtained by providing a metallized layer of wiring on the surface or interior of an insulation substrate, the insulation substrate is, for example, a multi-layer circuit board or a package for semiconductor element, the insutating substrate obtained from a sintered body having a linear expansion coefficient of 8 to 18 ppm/.degree. C. at 40.degree. to 400.degree. C. which is prepared by sintering a molded body containing 20 to 80% of a glass having a liner expansion coefficient of 6 to 18 ppm/.degree. C. at 40.degree. to 400.degree. C. and 80 to 20% of a filler having a linear expansion coefficient of at least 6 ppm/.degree. C. When the circuit board of the present invention is surface mounted on an outer electric circuit substrate such as a printed wiring board having a large linear expansion coefficient, the occurrence of stress due to a difference between the linear expansion coefficients of both is suppressed, and the circuit board and the outer electric circuit can be electrically connected accurately and firmly over a long period of time. Furthermore, a mounted structure of a circuit board having high reliability which can sufficiently dealt with the use of multiple pins due to large sizing of a semiconductor element can be realized. Furthermore, simultaneous sintering with the Cu metallized layer can be performed, and since the binder can be removed efficiently, the product is of high quality and is cheap.

Growing community of inventors

Kirishima, Japan

Masahiko Higashi