Hitachi, Ltd.

Hitachi Automotive Systems, Ltd.

Hitachi Car Engineering Co., Ltd.

Masahiko Asano

Shuji Eguchi

Kaoru Uchiyama

Masahide Harada

Nobutake Tsuyuno

Kunito Nakatsuru

Yasuo Akutsu

Toshiaki Ishii

Yujiro Kaneko

Hideto Yoshinari

Takehide Yokozuka

Koji Sato

Isamu Yoshida

Yoshio Kawai

Shiro Yamashita

Maki Ito

Kinya Nakatsu

Toshiya Satoh

Hiroshi Hozoji

Eiichi Ide

Masahiro Sasaki

Hiroatsu Tokuda

Junpei Kusukawa

Masaru Kamoshida

Takeshi Igarashi

Shinya Kawakita

Takayuki Fukuzawa

Shinichi Fujiwara

Eiji Nishioka

Mutsumi Watanabe

Yuusuke Yasuda

Yasuo Hitachi Ltd Intell Prop Gr Akutsu

Kaoru Hitachi Ltd Intell Pr Gr Uchiyama

Shuji Hitachi Ltd Intell Prop Gr Eguchi

Kunito Hitachi Ltd Intell Pr Gr Nakatsuru

An object is to provide the structure of an ECU enabling resin to be filled without deformation of an electronic circuit board. A resin-sealed vehicle-mounted control device includes: a circuit board; a base member housing the circuit board; and resin filled between the circuit board and the base member. The base member has: a base portion fixing the circuit board; and a side wall opposed to the side surface side of the circuit board. The resin is provided at least between the circuit board and the base portion. The side wall has an opening at any position on the side of the base portion from a position opposed to the side surface side of the electronic circuit board.

Resin-sealed vehicle-mounted control device

The invention provides an in-vehicle controller equipped with a heat radiation coating film which can efficiently radiate heat from a high temperature portion such as a heat generating body to a casing. An in-vehicle controller includes a heat radiation coating film, wherein the heat radiation coating film includes a first region that has a first boundary surface abutting on a base material, and a second region that has a second boundary surface where the heat radiation coating film abuts on air, wherein a thermal conductivity of the first region is higher than that of the second region, and wherein a thermal emissivity of the second region is higher than that of the first region.

In-vehicle controller

An insulation film that strongly adheres to a power semiconductor module having a resin sealer and a conductor plate and has high thermal conductivity is provided. An insulation layeris provided between a power semiconductor moduleand a heat dissipation portionB. The power semiconductor moduleincludes a resin sealer, which covers a circumferential side surface of a conductor plate, and a plurality of recessesD are provided in the resin sealer. The insulation layeris formed of a spray coated film, an insulation film, and a resin layer, and the spray coated filmis formed on the surface of the resin sealerincluding recessesD to form a seamless flat surface. The planar size of each of the recessesD is greater than the planar size of each flat portion, which forms the spray coated film

Power semiconductor module and power module

A modular control device comprises a control board, a sub-module and a housing cover, with a microcomputer mounted on the control board. The sub-module has a sub-module case provided with a wiring layer that is mounted into a wall of the sub-module case. Electronic parts are mounted in the sub-module case to electrically connect to the control board through the wiring layer. A housing cover accommodates the control board and the sub-module. A housing base is joined with the housing cover. The accommodation portion has a shape corresponding to a shape of each of the electronic parts is arranged in the housing cover. The sub-module is mounted to the housing cover with a heat radiation adhesive between the accommodation portion and each of the electronic parts.

Control device

In an electronic control device that includes two or more kinds of lead-insertion-type parts, including at least a coil and a capacitor, the parts are installed on a support that has a wiring, a terminal structure and mechanically fixing portions; the leads of the above parts are respectively inserted in and electrically connected to holes formed in the wiring portion of the support; the parts and the support are fixed to each other with an adhesion material for fixation; the upper surfaces of the parts are attached to a metallic chasis with a thermally conductive material of a low elasticity modulus interposed in between; the mechanically fixing portions of the support are fixed to the metallic chasis; and the terminal structure of the support is electrically connected to a circuit board that mounts at least a controlling element.

Electronic control device using LC module structure

An engine control unit for controlling an automobile engine, which is equipped with a booster circuit for boosting the voltage of battery power source, an injector driving circuit for driving an injector by making use of a boosted high voltage, and a microcomputer for controlling the engine; wherein the engine control unit is featured in that an LC module mounted with a booster coil constituting the booster circuit and with an electrolytic capacitor, a power module mounted with a rectifying device constituting the booster circuit and the injector driving circuit and with a switching device, and a control circuit board mounted with the microcomputer and with a connector acting as an interface for an external member of the engine control unit are laminated each other. The power module is partitioned into at least two portions and fixedly contacted, through a heat radiation part, with a housing cover, and heat radiation fins are arranged on an outer surface of the housing cover where the power module is disposed.

Engine control unit

A semiconductor device has a substrate with an electronic circuit, a semiconductor element provided at a first surface of the substrate and electrically connected by wire bonding to the electronic circuit, a metallic core layer electrically connected to the semiconductor element. A plurality of conductive bumps provided opposite the first surface of the substrate. A thermal hardenable resin seals at least the semiconductor element, and a metal plate is electrically connected to the metal core layer.

Semiconductor device and electronic control unit using the same

There is proposed an engine controller which is excellent in reliability in that the outer peripheral edge face (cut surface) of covering member can be prevented from being rusted while securing the water-proofness and dust-proofness. This engine controller comprises a circuit board () for controlling an engine; an aluminum die-cast main case body () having an open top; and a covering member () made of an iron-based metal plate which is preliminarily applied with surface treatment, the covering member () being fixedly clamped to the main case body () by means of a setscrew () so as to hermetically close the open top of the main case body (); wherein the main case body () is provided thereon with a pedestal () or groove () on which a liquid or jellied water-proofing adhesive () is coated or filled (piled), thereby enabling entire outer peripheral edge face () of the covering member () to be covered by the water-proofing adhesive ().

Engine controller

In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a motherboard is maintained. In the invention, a metal core base material of great heat capacity and high thermal conductivity is used for both the interposer substrate and the motherboard. Furthermore, a part where a core metal is exposed is provided on at least one of the interposer substrate and the motherboard. A solder joint pad is directly formed on the core metal exposed part, and the interposer substrate is solder-joined to the motherboard.

Electronic device

A device for controlling a vehiclecomprising a housing, a rectangular printed circuit boardwhich is fixed to the inside of the housing and has a control circuit thereon, and plugsandprovided along one side of the rectangular printed circuit boardto transfer signals between the inside and the outside of said housing; wherein the plugsandrespectively contain plug pins and the plug pinsare electrically connected to the printed circuit boardvia bonding wiresinside the housing

Device for controlling a vehicle

An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150&#xb0; C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing in which a pin of the connector is inserted into the through hole, the pin and the through hole are connected with a conductive member, and a reinforcement member for securing the connector and the board is further provided on the conductive member, thereby improving the reliability of the electronic device.

A device for controlling a vehiclehas a housing, a rectangular printed circuit board inside of the housing and a control circuit thereon. Plugs are provided along one side of the rectangular printed circuit board to transfer signals between the inside and the outside of the housing. The plugs have plug pins that are electrically connected to the printed circuit board within the housing.

A device for controlling a vehiclehaving a housing, a rectangular printed circuit boardwhich is fixed to the inside of the housing and has a control circuit thereon. Plugsandare provided along one side of the rectangular printed circuit boardto transfer signals between the inside and the outside of the housing. The plugsandrespectively contain plug pins and the plug pinsare electrically connected to the printed circuit boardvia bonding wiresinside the housing

The invention provides a packaging structure applied to an automotive component having semiconductors and electronic parts mounted on a ceramic base, characterized in that the semiconductors and electronic parts are partly or entirely sealed with a thixotropic silicone gel which has a thixotropy index of about 1.5-3.6 and a penetration depth of about 6-10 mm and a rate of change in viscosity of less than 10% of the initial value.

Growing community of inventors

Mito, Japan

Masahiko Asano