Matsushita Electric Industrial Co., Ltd.

Matsushita Electronics Corporation

Tomoegawa Paper Co., Inc.

Masahide Tsukamoto

Seiichi Nakatani

Hideo Hatanaka

Yutaka Nishimura

Tadashi Nakamura

Kouji Kawakita

Tamao Kojima

Hideki Higashitani

Akihito Hatakeyama

Toshio Sugawa

Daizou Andou

Hirotoshi Watanabe

Masahiro Nagasawa

Kazuhisa Morimoto

Yasuhiko Horio

Yoshinobu Kunitomo

Masanaru Hasegawa

Yoshinobu Murakami

Tetsuro Ohtsuka

Yasushi Fukumura

Keiji Saeki

Yasuyuki Sakashita

Makoto Nozu

Yoshifumi Kitayama

Mikinari Shimada

Osamu Yamamoto

Takeshi Shimamoto

Yasuo Fukui

Toru Ishida

Masayuki Sakai

Yo Hasegawa

Masayuki Okano

Kazufumi Yamaguchi

Noboru Aikawa

Akira Isomi

Hiroshi Sogo

Kazuo Eda

Satoru Fujii

Yoshihiro Bessho

Yutaka Taguchi

Hiroaki Takezawa

Minehiro Itagaki

Koji Matsuo

Chikara Murata

Hiroshi Yamazoe

Fumikazu Tateishi

Kouji Nishimura

Tetsuhiro Sano

Kohji Matsuo

Hitoshi Ono

Yoshitaka Yoshikawa

Itaru Kawasaki

Masato Hagino

Tomoaki Nyuji

Yoshihiro Kirihata

Yasukiho Horio

Fumikazu Tateishii

Masahiro Noguchi

A method for producing printed wiring boards comprises the steps of perforating through holes at predetermined positions in an adhesive insulator sheet, filling the through holes with a conductive material such as a conductive paste or metal balls, transferring conductive wiring patterns that have been formed on surfaces of releasable supporting sheets onto the surfaces of the adhesive insulator sheet by heat and pressure. Simultaneously, interlayer via-connections are performed by means of the conductive material filled into the through holes.

Method for producing printed wiring boards

A fixture with movable pawls and positioning walls is attached to a circuit board. An electronic component is inserted into the fixture from its upper side. Since the movable pawls move outward due to their slopes, the electronic component is allowed to fit between the positioning walls. After the fitting of the electronic component, the movable pawls hold the sides of the upper face of the electronic component and the positioning walls are in contact with the peripheral walls of the electronic component. Bumps provided on electrode pads of the electronic component are connected to electrodes on the circuit board. Thus, the electronic component can be mounted using the flip chip technique. In addition, the electronic component can be removed easily by moving the movable pawls even after being mounted.

Fixture, circuit board with fixture, and electronic-component mounted body and method of manufacturing the same

Through holes formed in an electrical insulating substrate having adhesive layers on its both surfaces are filled with a conductor. Then, supporting bases having wiring layers with a predetermined pattern are laminated on both the surfaces of the electrical insulating substrate, which are then heated and pressurized. After that, the supporting bases are removed, thus obtaining a circuit board in which the wiring layers have been embedded in the adhesive layers. The conductor within the through holes are compressed sufficiently, thus forming minute via holes with high reliability.

Circuit board and method of manufacturing the same

A printed wiring board includes at least one insulator sheet having through holes filled with conductive material and a conductive wiring pattern. The wiring pattern is embedded in the insulator sheet so that an upper surface of the wiring pattern and surrounding portions of the insulator sheet form a flat surface. The insulator sheet may be made from a glass-epoxy prepreg or of a polyester or polyimide sheet coated with an adhesive or glue. The wiring pattern can be transferred to the insulator sheet from a surface of a releasable supporting sheet.

Printed wiring board

Transmission line structure is composed of a pair of signal conductors which are embedded in one wiring region of a dielectric layer and a thickness in height of the signal conductor is larger than a width, and is constituted so that a coupling impedance between the adjacent signal conductors is lower than a coupling impedance between the signal conductor and another conductor formed in another wiring region, and thus to provide a multi-layer wiring board having a transmission line structure of high wiring density and excellent transmission characteristic.

Multilayer wiring board embedded with transmission line conductor

Bump components mounted on a circuit board on a supporting substrate is covered with a flexible separation wall. A pressure difference is provided between the inner and outer sides of the separation wall and thus the bump components are pressed against the circuit board. When heating is carried out in this state, the bump components and the circuit board are connected with a conductive adhesive or solder. During the heating, the circuit board is not deformed. Therefore, a bump-component mounted body can be manufactured with high yield.

Method of manufacturing bump-component mounted body and device for manufacturing the same

A stress relaxation type electronic component which is to be mounted on a circuit board, wherein a stress relaxation mechanism member is disposed on a surface of said electronic component, said surface being on a side of a connection portion where said electronic component is to be connected to said circuit board, and said stress relaxation mechanism member is electrically conductive.

Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body

A printed circuit board has: a base material layer having a first via hole; and an insulating layer having a second via hole, the insulating layer being provided on one surface of the base material layer, wherein a cross-sectional area of the second via hole is smaller than a cross-sectional area of said first via hole, and wherein the first and second via holes are filled with a conductive material.

Printed circuit board and electronic components

Method of making printed circuit board

A method of forming a multilayered pattern in an electronic part wherein a pattern of multilayer wiring is formed via insulating layers in which a pattern for a succeeding layer is formed by adjusting to a position and a configuration of the pattern which was already formed by recognizing a position and configuration of the pattern.

Pattern formation method for multi-layered electronic components

A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan .delta.) peak value at 30-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.

Nonwoven fabric cloth substrate for printed wiring boards, and prepreg

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Nara, Japan

Masahide Tsukamoto