Matsushita Electric Works, Ltd.

Panasonic Electric Works Co., Ltd.

Masahide Muto

Yoshiyuki Uchinono

Toshiyuki Suzuki

Yutaka Iwahori

Ryoji Yokotani

Masaru Sugimoto

Takuma Hashimoto

Satoshi Mori

Hideyoshi Kimura

Kazuo Sawada

Yasufumi Masaki

Koji Nishioka

Shinya Ishizaki

A light-emitting device () has a submount () and a plate for heat transfer () having a metallic plate (). The submount () has a mount base (), at least one light-emitting diode chip () mounted thereon and electrically conducting lines (-) formed on the mount base () to be connected electrically to the light-emitting diode chip (). A first plane () of the mount base () of the submount () is bonded thermally to the first plate (). For example, the plate is a circuit board having a metallic plate (), and the submount () is bonded thermally to the metallic plate () of the one of the at least one plate (). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base () for providing a plurality of heat transfer paths.

Light-emitting device

A molded interconnect device (MID) having a multilayer circuit of a reduced thickness, in which a layer-to-layer connection(s) is formed with high reliability, is provided as a multilayer circuit board. The multilayer circuit board comprises a substrate having a first surface and a second surface extending from an end of the first surface at a required angle relative to the first surface, and the multilayer circuit formed on the first surface and composed of a plurality of circuit layers. Each of the circuit layers is provided with a conductive layer having a required circuit pattern and an insulation layer formed on the conductive layer by film formation. The layer-to-layer connection of the multilayer circuit is made through a second conductive layer formed on the second surface of the substrate.

Multilayer circuit board and method of manufacturing the same

Growing community of inventors

Kobe, Japan

Masahide Muto