Fujitsu Component Limited

Masahide Mochizuki

Kazuaki Miyanaga

Hiroaki Kohinata

Satoshi Matsumoto

Shigeki Nakayama

Katsuyuki Takahashi

Daishi Kitajima

Natsumi Sakai

Koyuru Kobayashi

Yusuke Uchiyama

Syunya Kotaki

An electromagnetic relay including a housing, a cover, an adhesive which is interposed between a side part of the housing and an inner surface of the cover and which secures the housing and the cover, and a projection which is formed in at least one of the side part and the inner surface. The adhesive is filled in a gap between the side part and the inner surface.

Electromagnetic relay

Provided is a terminal of a relay, by which defective sealing in the relay can be prevented. A movable terminal of the relay has: a first plate including a first inner surface, a first outer surface opposed to the first inner surface, and a first through opening which opens to the first inner surface and the first outer surface; a second plate including a second inner surface, a second outer surface opposed to the second inner surface, and a second through opening which opens to the second inner surface and the second outer surface; and a folded part which connects the first plate to the second plate. The first through opening is partially overlapped with the second through opening, and the second inner surface is partially exposed to the first through opening.

Terminal of relay, and relay

An electromagnetic relay includes a fixed contact module including a fixed contact, a movable contact module including a movable contact disposed to face the fixed contact, an armature formed of a magnetic material and configured to move the movable contact module to bring the movable contact into and out of contact with the fixed contact, and an electromagnet configured to generate a magnetic field to move the armature. At least one of the fixed contact module and the movable contact module includes a joint at which different components are joined by riveting, and a film with a thermal conductivity higher than, the thermal conductivity of the fixed contact module and the movable contact module is formed on at least one of the fixed contact module and the movable contact module including the joint.

Growing community of inventors

Tokyo, Japan

Masahide Mochizuki