Fujitsu Corporation

Masahide Kodama

Atsushi Endo

Hideo Kubo

Takashi Urai

Keita Hirai

Kenji Sasabe

Hideki Kimura

Yoichi Sato

Katsuhiko Nakata

Nobumitsu Aoki

Shinnosuke Fujiwara

Yuki Kanai

Kento Ohga

A liquid cooling module includes a heat-receiver, an inlet-passage in which a flow-path through which the liquid-refrigerant flowed from an inlet flows is formed, a first flow-passage in which the flow-path continues from the inlet-passage, and that is formed as spreading in a fan-like shape as viewed in a normal-direction of a heat-receiving-surface, a second flow-passage in which the flow-path continues from the first flow-passage, and that is formed toward the heat-receiver in the normal-direction, a diffuser in which grooves that continue from the second flow-passage in the heat-receiver and diffuses the liquid-refrigerant along a surface on an opposite side of the heat-receiving-surface is formed, a third flow-passage in which the flow-path continues from the grooves, and that is formed in the normal-direction and a direction in which the flow-path is separating from the heat-receiver, and an outlet-passage in which the flow-path continues from the third flow-passage to an outlet.

Liquid cooling module

A cooling device includes a vessel having a refrigerant sealed inside, an evaporator that receives heat to evaporate a liquid phase of the refrigerant inside the vessel, a condenser that dissipates heat to condense a vapor phase of the refrigerant inside the vessel, a tube shaped transporter that transports the liquid-phase refrigerant inside the vessel to the evaporator by capillary action, and a gap generator that generates a gap between the transporter and the evaporator for the liquid-phase refrigerant to move from the transporter to the evaporator.

Cooling device

A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.

A disclosed unit device: two first circuit boards provided apart from each other in a horizontal direction; heat generating components respectively provided on the two first circuit boards; two second circuit boards provided between the two first circuit boards, arranged to stand at a distance from each other, and each having an opening; and a fan provided between the two second circuit boards and configured to cool the heat generating components on the two first circuit boards by drawing air through the opening of one of the second circuit boards and by expelling the air through the opening of the other second circuit board.

Unit device

Growing community of inventors

Kawasaki, Japan

Masahide Kodama