Mitsubishi Denki Kabushiki Kaisha

Nippon Thompson Co., Ltd.

Nippon Telegraph and Telephone Corporation

Showa Denko K.k.

Showa Denko Kabushiki Kaisha

Masaharu Yoshida

Makoto Kanda

Masataka Takehara

Yasufumi Nakasu

Tsuneo Akasako

Hiroshi Uchida

Hideki Kuwabara

Toshinobu Banjo

Satoshi Noda

Hiroshi Fukumoto

Akira Yamamoto

Takaaki Tsuboi

Minoru Takaishi

Shigenobu Ishihara

Takeshi Onoda

Manabu Horita

Kazuyoshi Tateishi

Katsuaki Nakano

Akitomo Mine

Kunihiko Kito

Noboru Suzuki

Kenichiro Takiguchi

Kentaro Narita

Ken'ichi Arakawa

Tsuyoshi Takahashi

Hiroki Imakura

In a linear motion guide unit, in order to prevent direct collision of a roller, or a rolling element, with an end portion of a carriage, an extending portion of a spacer of an end cap is disposed at the end portion of the carriage for absorbing impact resulting from collision of the roller. The spacer has the extending portion which protrudes from the spacer at a position adjacent to an inner circumferential surface of a turnaround passage and which has a wall surface continuous from the inner circumferential surface of the turnaround passage. The wall surface of the extending portion serves as a collision receiving surface for receiving a colliding roller. The carriage has a housing recess which is formed at an end of a raceway groove thereof and to which the extending portion is fitted.

Linear motion guide unit

A linear motion guide unit prevents damage to a corner portion of an end surface of a carriage resulting from high-speed rolling of the rolling elements, and eliminates the need for strict dimensional management of facing end surfaces of the carriage and a spacer. A crowning is formed at an end portion of the carriage, and an R chamfered portion is formed at a corner of an end surface of the carriage. An R chamfered portion is formed at a corner of the end surface of the spacer. The R chamfered portions define a valley portion between the facing surfaces of the carriage and the spacer. The rolling elements roll above the valley portion while striding it to thereby be prevented from colliding against the corner portion of the end surface of the carriage, whereby damage to the corner portion of the end surface of the carriage can be prevented.

A curvilinear motion rolling guide unit is such that pipe members adapted to form return passages are disposed respectively at undercuts of wings of an arcuate casing, thereby reducing working costs. A slider has a casing and end caps fixed to respective opposite ends of the casing. Pipe members adapted to form return passages are disposed at the respective undercuts formed on the wings of the casing. Cover members have longitudinally extending grooves, respectively, for covering the pipe members. Fitting grooves formed at opposite ends of the grooves of the cover members are fitted to direction changing passages provided in the respective end caps, whereby the cover members are fixed to the end caps.

Curvilinear motion rolling guide unit

A bump forming apparatus includes a first tank storing fused solder, a cavity having an inlet for the fused solder, a nozzle arranged on a lower portion of the cavity, a pressure element formed by a diaphragm and a piezoelectric element, and a first heater heating the first tank, a pipe and the cavity. The bump forming apparatus further comprises a static pressure control part having a second tank storing solid solder, a second heater provided around a second opening, a level detector detecting the surface level of the fused solder in the first tank and a level control part controlling driving of the second heater on the basis of a detection signal from the level detector. Thus obtained are a bump forming apparatus and a bump forming method capable of properly avoiding defective discharge, increasing the speed of discharge, avoiding dispersion of an amount of discharge and stabilizing discharge.

Bump forming apparatus and bump forming method

The present invention offers a light scanner which is compact and highly precise during high-speed operation, has a long lifespan, and is resistant to influence by external acceleration. Specifically, a light beam emitted from an optical source 20 is separated into two light beams by means of a light beam separation means 30, and these light beams are deflected by a mirror 43 on the scanner 40. On of the light beams is used for the object of usage, while the other light beam is made incident on a photo detector 50 which outputs a signal based on the incident position of the light beam, in order to determine the deflection angle of the light beam based on vibrations of the mirror 43.

Light scanner

In order to position an optical semiconductor element in high accuracy and to readily fabricate the same, step is formed on an upper surface of a forward end of an electrode (123) projecting from a lead frame. A submount (102) is previously soldered to a lower stage surface (125), while solder (172) is applied to its upper surface. A collet (61) which is softly supported by a spring (63) in the vertical direction suctionally holds a laser diode element (101) and approaches the electrode (123) from above, to be stopped when its leg portion (61b) comes into contact with an upper stage surface (126). Thus, the laser diode element (101) is precisely positioned. In this state, the solder (172) is heated and cooled, to solder the laser diode element (101) to the submount (102). The laser diode element (101) molded with transparent resin, to be easy to fabricate.

Optical semiconductor device for optical communications with increased

The present invention relates to a rolling guide unit wherein spatter scattered as a result of arc welding, gas welding and so forth does not adhere to the track rail. The effect is obtained by forming a fluororesin coating layer on the surface of the track rail.

Rolling guide unit production process

An apparatus for bonding lead terminals to bumps of a semiconductor chip by using a laser beam. On the basis of a temperature signal obtained from irradiation of a lead terminal and a bump to be bonded together under irradiation of the laser beam, state of contact and the bond between the bump and the lead terminal are decided. The bonding between the terminals and the bumps can be realized without fail by checking the state of contact therebetween in precedence to the bonding operation.

Bonding method and apparatus

Rolling guide unit and its production process

A bonding apparatus according to the present invention bonds a semiconductor chip to a conductive member in the face-down style without heating the semiconductor chip. The semiconductor chip which consists essentially of silicon is placed on leads which are put on a TAB tape. A glass plate member is mounted on the semiconductor chip. An infrared light beam is irradiated onto the semiconductor chip from above the semiconductor chip. Transmitted by the semiconductor chip, the infrared light beam illuminates bumps. As a result, the bumps heat up and melt. Since the semiconductor chip does not absorb the infrared light beam, bonding of the semiconductor chip to the leads does not cause a rise in temperature of the semiconductor chip. The bonding apparatus according to the present invention makes the face-down style bonding possible.

Bonding method and bonding apparatus

A bonding apparatus comprises a base (16) for supporting a printed circuit board (7), an atmosphere cover (1) which has a concavity (1c) covering a semiconductor device (5) mounted on the printed circuit board (7) and which is formed of laser light transmitting material, driving means (1j) for moving the atmosphere cover (1) upwards and downwards related to the base (16), pressing means (2) and (3) provided in the atmosphere cover (1) for pressing the semiconductor device (5) toward the printed circuit board (7), and laser heating means (9) for bonding a lead terminal (6) of the semiconductor device (5) with a junction (7a) of the printed circuit board (7). The laser heating means (9) irradiates laser light (9a) through the atmosphere cover (1) to bonding agent (8) applied between a junction (6a) of the lead terminal (6) of the semiconductor device (5 ) and the junction (7a) of the printed circuit board (7), and heats and fuses the bonding agent (8) to bond both the junctions without touching the junctions thereof. Also, inside the atmosphere cover (1), atmosphere gas supplying means (1d), (1e), (1f) and (1g) are provided for supplying atmosphere gas, (4) which is employed for preventing oxidation in the bonding.

Laser bonding apparatus

A bonding apparatus comprises a base (16) for supporting a printed circuit board (7), an atmosphere cover (1) which has a concavity (1c) covering a semiconductor device (5) mounted on the printed circuit board (7) and which is formed of laser light transmitting material, driving means (1j) for moving the atmosphere cover (1) upwards and downwards related to the base (16), pressing means (2) and (3) provided in the atmosphere cover (1) for pressing the semiconductor device (5) toward the printed circuit board (7), and laser heating means (9) for bonding a lead terminal (6) of the semiconductor device (5) with a junction (7a) of the printed circuit board (7). The laser heating means (9) irradiates laser light (9a) through the atmosphere cover (1) to bonding agent (8) applied between a junction (6a) of the lead terminal (6) of the semiconductor device (5 ) and the junction (7a) of the printed circuit board (7), and heats and fuses the bonding agent (8) to bond both the junctions without touching the junctions thereof. Also, inside the atmosphere cover (1), atmosphere gas supplying means (1d), (1e), (1f) and (1g) are provided for supplying atmosphere gas (4) which is employed for preventing oxidation in the bonding.

A die bonding apparatus includes a Z-axis direction drive mechanism having a main drive motor, a bonding arm having a first arm and a second arm, a holding device provided on one end of the second arm for releasably holding a die, a torque generating device for applying a torque to the second arm, a parallel position detecting device for detecting a displacement of the second arm from a state in which the die and the bonding surface are parallel to each other and for generating a displacement signal, and a control device for storing an inclination of the bonding surface beforehand and for controlling the descent of the second arm and the application of a load to the die.

Die bonding apparatus and method of controlling the same

Resin compositions for laminated sheets and laminated sheets produced therefrom are disclosed, the compositions comprising at least one allyl ester resin composed of a polybasic acid and a polyhydric alcohol, wherein an allyl ester group of said resin is bonded to at least one of terminals thereof.

Allyl ester resin composition and laminated sheet using the same

Disclosed is a method for die bonding, comprising the steps of arranging a wafer having a multiplicity of mutually separated semiconductor chips vertically and near a lead frame which is conveyed horizontally, and picking up each of the semiconductor chips from the wafer and bonding the same onto the lead frame.

Growing community of inventors

Fukuoka, Japan

Masaharu Yoshida