Hitachi Metals, Ltd.

Neomax Materials Co., Ltd.

Nippon Paint Compnay, Ltd.

Neomax Co., Ltd.

Aoyama Seisakusho Ibaraki Plant Co., Ltd.

Masaharu Yamamoto

Masaaki Ishio

Yoshimitsu Oda

Masayuki Yokota

Ryoji Inoue

Kouji Kawahara

Masaru Fujiyoshi

Masatoshi Ohata

Yoshito Tagashira

Yoshiharu Tsuboi

Hirofumi Nakano

Takayuki Furujo

Naonori Ishii

Junji Hira

Naruaki Tomita

Tsuyoshi Tanaka

Shigeji Matsubara

Toshiaki Fukusako

The method manufactures a hermetic sealing lid member used for an electronic component housing package including an electronic component arrangement member on which an electronic component is arranged. The method includes forming a clad material in which a silver brazing layer that contains Ag and Cu and a first Fe layer arranged on the silver brazing layer and made of Fe or an Fe alloy are bonded to each other by roll-bonding a silver brazing plate that contains Ag and Cu and a first Fe plate made of Fe or an Fe alloy to each other and performing first heat treatment for diffusion annealing; softening the clad material by performing second heat treatment; and forming the hermetic sealing lid member in a box shape including a recess portion by bending the softened clad material.

Method for manufacturing hermetic sealing lid member

This glass bonding material () is made of a cladding material () in which at least a first layer () made of an Al-based alloy and configured to be bonded to glass and a second layer () made of an Fe&#x2014;Ni based alloy having a thermal expansion coefficient from 30&#xb0; C. to 400&#xb0; C. of 11.5&#xd7;10(K) or less are bonded.

Glass bonding material and multilayer glass

This hermetic sealing lid member () is made of a clad material () including a silver brazing layer () that contains Ag and Cu and a first Fe layer () bonded onto the silver brazing layer and made of Fe or an Fe alloy. The hermetic sealing lid member is formed in a box shape including a recess portion () by bending the clad material.

Hermetic sealing lid member

This method for manufacturing a hermetic sealing lid member () includes forming a Ni plated metal plate () by forming a Ni plated layer () on a surface of a metal plate () having a corrosion resistance and forming the hermetic sealing lid member by punching the Ni plated metal plate.

Method for manufacturing hermetic sealing lid member, and method for manufacturing electronic component housing package

A battery terminal includes a shaft portion and a flange portion. The battery terminal is made of a clad material in which at least a first metal layer and a second metal layer are bonded to each other. Each of the shaft portion and the flange portion includes the first metal layer on a first side in a shaft direction and the second metal layer on a second side in the shaft direction. The first metal layer in the shaft portion includes a protruding portion that further protrudes to the second side in the shaft direction with respect to a surface of the first metal layer on the second side in the shaft direction in the flange portion.

Battery terminal, method for manufacturing battery terminal, and battery

A battery terminal includes an overlay clad plate material including at least a first metal layer made of Al or Al alloy and a second metal layer made of Cu or Cu alloy, formed by bonding at least the first metal layer and the second metal layer to each other in the thickness direction. Either the first metal layer or the second metal layer of the clad plate material is partially removed to form an exposure surface on which either the second metal layer or the first metal layer is exposed in the clad plate material.

A connection plate for battery terminals capable of inhibiting a first member and a second member from being detached from each other is provided. This bus bar(connection plate for battery terminals) includes a first member () including a first hole () and an embedding hole (), made of first metal and a second member () having a second hole (), including a base () made of second metal, embedded in the embedding hole of the first member, while an intermetallic compound layer () containing at least one of the first metal and the second metal is formed on an interface between the embedding hole of the first member and the second member.

Connection plate for battery terminals and method for manufacturing connection plate for battery terminals

A connection plate for battery terminals capable of inhibiting a base and a battery terminal connection portion from being detached from each other is provided. This connection plate for battery terminals () includes a battery terminal connection portion () fitted into a second hole () of a base () made of first metal, including a hole for connection () into which a second battery terminal () is inserted and a flange portion (), while the battery terminal connection portion is constituted by at least a first layer () made of second metal, arranged on a side opposite to the base and a second layer () made of third metal, arranged between the base and the first layer.

Provided is an airtightly sealing cap, by which a use quantity of Au is reduced in a soldering material for sealing a miniaturized electronic component storing package. An airtightly sealing cap () is used for an electronic component storing package () which includes an electronic component storing member () for storing an electronic component (). The airtightly sealing cap is provided with a base material (); a base layer () which is formed on the surface of the base material and contains Ni; and a soldering material layer (), which is formed on the base layer, has a thickness of 10 &#x3bc;m or less and composed of Au and Sn. The content percentage of Au in the soldering material layer is 43 mass % or more but not more than 64 mass %.

Airtightly sealing cap, electronic component storing package and method for manufacturing electronic component storing package

A more thinnable hermetic sealing cap can be provided. This hermetic sealing cap () is employed for an electronic component housing package () housing an electronic component () and includes a cap body portion () mainly composed of Ti.

Hermetic sealing cap

A hermetic sealing cap can be provided which is capable of suppressing that a production process becomes complicated, and additionally of suppressing that a solder layer wetly spreads inward on a sealing surface. This hermetic sealing cap () includes a base member (), a first plating layer () that is formed on the surface of the base member, and a second plating layer () that is formed on the surface of the first plating layer and is less oxidized than the first plating layer, wherein a part of the second plating layer in an area (S, S) inside an area (S, S) to which an electronic component accommodation member is joined is removed so that the surface of the first plating layer is exposed, and the surface of the first plating layer that is exposed in the area from which the second plating layer is removed is oxidized.

Hermetic sealing cap, electronic component accommodation package, and method for producing hermetic sealing cap

A hermetic sealing cap member capable of suppressing deterioration of characteristics of an electronic component resulting from a sealant such as solder coming into contact with the electronic component in a package is obtained. This hermetic sealing cap, which is a hermetic sealing cap employed for an electronic component storing package for storing an electronic component (), comprises a hermetic sealing cap member (), a first plating layer () formed at least on a region other than a region of the hermetic sealing cap member formed with a sealant () and a second plating layer (), formed on the region of the hermetic sealing cap member on which the sealant is arranged, containing a material superior in wettability with the sealant to the first plating layer.

Hermetic sealing cap and method of manufacturing the same

The method for producing a solder bump transfer sheet of the invention includes the steps of: providing a sheet having a chromium oxide layer containing substantially no iron oxide as the outermost surface; and forming a plurality of solder bumps placed in a predetermined pattern on the chromium oxide layer.

Solder bump transfer sheet, method for producing the same, and methods for fabricating semiconductor device and printed board

Disclosed is a polymer prepared from an .alpha.,.beta.-ethylenic unsaturated compound, characterized by having a structure represented by the following general formula (1): ##STR1## (where, R.sup.1 and R.sup.2, which are the same or different, a C1-C4 alkyl group, m is an integer of 1-10 and n is 0, 1 or 2) in the molecule.

Growing community of inventors

Suita, Japan

Masaharu Yamamoto