Showa Denko Materials Co., Ltd.

Hitachi Chemical Company, Ltd.

Masaharu Matsuura

Nobuyuki Ogawa

Akira Shimizu

Takashi Naito

Akitoyo Konno

Fumio Inoue

Shin Takanezawa

Akishi Nakaso

Shinichi Tachizono

Tatsuya Miyake

Yuji Hashiba

Yasuyuki Mizuno

Taigo Onodera

Hiroyuki Fukai

Yasuo Inoue

Tetsurou Irino

Hiroaki Fujita

Takahiro Ikabata

Toyoki Ito

Tomoaki Yamashita

Keita Yuguchi

Takayuki Suzukawa

Ikuo Sugawara

Yuuki Tezuka

The present invention relates to a support-attached resin film for an interlayer insulating layer, including a support, and a resin composition layer formed on one side surface of the support in which the support has particles exposed on the one side surface, and an average maximum height of exposed portions of the particles is 1.0 &#x3bc;m or less, or the support has no particles exposed on the one side surface, a multilayer printed wiring board using the support-attached resin film for an interlayer insulating layer, and the multilayer printed-wiring board.

Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board

Provided is an interlayer insulating film for a multi-layered printed wiring board, including a wiring embedding layer (A) obtained by forming a thermosetting resin composition (I) into a layer, and an adhesion assisting layer (B) obtained by forming a thermosetting resin composition (II) into a layer, in which the interlayer insulating film contains a residual solvent in an amount of 1% to 10% by mass in a total amount of the wiring embedding layer (A) and the adhesion assisting layer (B), and the residual solvent contains an organic solvent having a boiling point of 150&#xb0; C. to 230&#xb0; C. in an amount of 10% by mass or more in a total amount of the residual solvent.

Interlayer insulating film and method for producing same

The lead-free glass composition contains vanadium oxide, tellurium oxide, alkali metal oxide, iron oxide, barium oxide, and tungsten oxide while containing substantially no phosphorus oxide, and further contains at least one of additional components including yttrium oxide, lanthanum oxide, cerium oxide, erbium oxide, ytterbium oxide, aluminum oxide, and gallium oxide. A content of the tellurium oxide is equal to or more than 25 mol %, and equal to or less than 43 mol % in terms of oxide TeO. A content of the alkali metal oxide is equal to or more than 4 mol %, and equal to or less than 27 mol % in terms of oxide RO (R: alkali metal element).

Lead-free glass composition, and glass composite material, glass paste, and sealing structure body containing the same

An adhesive film according to the present invention includes a resin composition layer (layer A) for an interlayer insulating layer, a thermosetting resin composition layer (layer B), and a support film (layer C), and the layer C, the layer A, and the layer B are sequentially arranged in this order. The layer A is a resin composition which contains a thermosetting resin (a1) and an inorganic filler (b1) having a specific surface area of 20 m/g or more, and the mass ratio of the thermosetting resin (a1) to the inorganic filler (b1) is within the range from 30:1 to 2:1. The layer B contains a thermosetting resin composition which is in a solid state at a temperature lower than 40&#xb0; C. but melts at a temperature of 40&#xb0; C. or higher but lower than 140&#xb0; C. Consequently, the adhesive film according to the present invention can solve problems in a laser process and a desmear removal process following the laser process and can form a conductor layer which has a high adhesion strength even on an interlayer insulating layer having a smooth surface-roughened state.

Adhesive film, multilayer printed wiring board using adhesive film, and method for manufacturing multilayer printed wiring board

A method of treating the surface of copper is provided to ensure adhesive strength between the surface of copper and an insulating layer without forming irregularities exceeding 1 &#x3bc;m on the surface of copper and to improve insulation reliability between wirings. A copper whose surface is treated by the above surface treating method is also provided. The method of treating the surface of copper comprises the surface of copper comprising the steps of: forming a metal nobler than copper discretely on the surface of copper; and subsequently oxidizing the surface of copper by using an alkaline solution containing an oxidant.

Method of treating the surface of copper and copper

Growing community of inventors

Tokyo, Japan

Masaharu Matsuura