Tomoegawa Paper Co., Inc.

Masaharu Kobayashi

Takeshi Hashimoto

Yukinori Sakumoto

Katsuji Nakaba

Takeshi Nishigaya

Fumiyoshi Yamanashi

Takeshi Sato

Daisuke Orino

Osamu Oka

Tadao Matsunaga

Takeshi Shima

Yasuhiro Yoshii

Thermosetting low-dielectric resin composition and use thereof

An adhesive composition for semiconductor devices contains as essential components (A) epoxy resin, (B) phonolic resin, (C) epoxidized styrene-butadiene-styrene block copolymer and (D) diaminosiloxane compound. The adhesive composition is excellent in heat resistance, thermal cycle test and humidity resistance. An adhesive sheet employing the above adhesive composition is also provided.

Adhesive composition and adhesive sheet for semiconductor devices

The present invention relates to a thermosetting low dielectric resin composition, a laminate for use in printed wiring, a laminate for a circuit, and the like. The present invention's thermosetting low dielectric resin composition contains a specific siloxane denatured polyimide, a compound having two or more allyl or methylallyl groups, and a compound having two or more maleimide groups. This resin composition adheres extremely well to metals with a low dielectric constant and low dielectric dissipation factor, and demonstrates very little scattering of the resin during operational processes like punching or cutting. By using laminates or laminates for circuits that employ this resin composition, electrical signals can be propagated more quickly, enabling signals to be processed at faster speeds. In addition, the present invention can be applied to the formation of miniaturized circuit wiring, and is suitably employed in electronic devices employed in the high frequency region, and, in particular, in electronic devices that must be made smaller and lighter in weight.

Thermoplastic resin composition having low permittivity, prepreg, laminated plate and laminated material for circuit using the same

An electrostatic chuck device is characterized in the provision of a ceramic layer, which serves as an adsorption surface, via an electricity insulating elastic layer, and an electrode that is formed between the ceramic layer and the electricity insulating elastic layer. The electricity insulating elastic layer consists of an adhesive that contains a rubber component and a phenol-type antioxidant. This electrostatic chuck device does not easily experience wear or deformation, and has extremely high durability. The electricity insulating elastic layer relieves stress caused by differences in coefficients of thermal expansion during heating, or by slight volume changes in the resin material. As a result, the stress applied on the ceramic layer can be reduced, making it possible to limit a reduction in the degree of flatness and the like.

Electrostatic chuck device

This invention is to provide a liquid adhesive of the present invention can be adhered and cured at a relatively low temperature and have sufficient heat resistance and reliability, etc., and an adhesive tape using the same. The liquid adhesive of this invention is obtainable by dissolving (a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight, and an amino equivalent of 500-10,000, represented by the following formula (I): ##STR1## wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.3 to 93; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in the range of 10 to 900 parts by weight. This is applied to one or both surfaces of a heat resistant film or one surface of a release film to form an adhesive layer, thereby obtaining an adhesive tape for electronic parts.

Adhesive tape for electronic parts and liquid adhesive

This invention is to provide a liquid adhesive can be adhered and cured at a relatively low temperature and have sufficient heat resistance and reliability, etc., and an adhesive tape using the same. The liquid adhesive of this invention is obtainable by dissolving

A liquid adhesive comprising a dispersion of the following component (b) in a solution of the following component (a) in an organic solvent:

Liquid adhesive for electronic parts and process for forming insulating

The piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer of this invention is a novel substance useful as an adhesive component for adhesive tapes, which tapes are used in the interior of a resin-sealed type semiconductor device. The copolymer has a weight average molecular weight of 10,000-200,000, and is represented by the following general formula (I) and obtained by condensing a carboxyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000 with N-aminoethylpiperazine in the presence of a phosphite and a pyridine derivative to undergo the amidation. ##STR1## wherein k, m, and n indicate molar proportions, where n is taken as 1, k is a number in the range of 3-175, and m is a number in the range of 0.3-93.

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Shizuoka, Japan

Masaharu Kobayashi