Murata Manufacturingco., Ltd.

Murata Manufacturing Co., Ltd.

Masaharu Fujiya

Toru Takeshita

Kazushi Watanabe

Yasuyuki Toyota

Takahiro Norichi

Masaaki Shimada

Ryuta Yamada

Tatsuya Ikeshima

An electronic component including a pad electrode provided on a wiring electrode and a Au bump provided on the pad electrode, wherein the uppermost layer of the wiring electrode is a first Ti layer, the uppermost layer of the pad electrode is a Au layer, and the thickness of the first Ti layer in at least a portion on which the Au bump is superposed in plan view is greater than the thickness of at least a portion of the first Ti layer in a portion on which the Au bump is not superposed in plan view.

Electronic component including a pad electrode and a bump stacked on a wiring electrode

An elastic wave device includes a substrate, an elastic wave element, and an exterior resin layer. The substrate includes an outer electrode on one main surface thereof and a first mounting electrode on another main surface thereof. The elastic wave element includes a piezoelectric substrate, a transmission functional electrode, a reception functional electrode, and ground terminals on one main surface of the piezoelectric substrate, and the ground terminals are connected to the first mounting electrode. High-thermal-conductivity conductor layers are provided on another main surface of the piezoelectric substrate, conductor vias penetrate between both main surfaces of the piezoelectric substrate, and the high-thermal-conductivity conductor layers and the ground terminals are connected to each other by the conductor vias.

Elastic wave device

An elastic wave device includes a substrate, an IDT electrode, a wire, an electrically insulating film, and an identification marking. The substrate has piezoelectricity. The IDT electrode is provided on the substrate and includes a pair of comb-shaped electrodes facing each other. The wire is provided on the substrate and connected to the IDT electrode. The electrically insulating film is provided at least on the IDT electrode and the wire. The identification marking is defined by an uneven portion of a surface of the electrically insulating film. The identification marking does not to overlap the IDT electrode in plan view of the substrate.

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Nagaokakyo, Japan

Masaharu Fujiya