Shimadzu Corporation

Masafumi Tsuji

Yohei Ukai

A power supply device is provided with an electronic component assembly configuring a power supply, an encapsulating material encapsulating the electronic component assembly, the encapsulating material having a first linear expansion coefficient, an enclosure member filled with the encapsulating material, a portion of the enclosure member in contact with the encapsulating material having a second coefficient of linear expansion coefficient, and a housing formed by a member having a third linear expansion coefficient. The first linear expansion coefficient of the encapsulating material is closer to the second linear expansion coefficient of the enclosure member than the third linear expansion coefficient of a member forming the housing.

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Kyoto, Japan

Masafumi Tsuji