Fujitsu Corporation

Fujitsu Semiconductor Limited

Masafumi Tetaka

Kazuto Tsuji

Shinichiro Maki

Fumitoshi Fujisaki

Masanori Onodera

Yoshiyuki Yoneda

Hideharu Sakoda

Seiichi Orimo

Yukio Saigo

Kenji Itasaka

Terumi Kamifukumoto

Nobuo Ooyama

Yasuo Yatsuda

Syunichi Kuramoto

Youichi Matae

Atsushi Yano

Nobuo Ohyama

Akihiro Shigeno

Ryoichi Yokoyama

Masao Fukunaga

A semiconductor device and a method of producing the same are provided. The semiconductor device includes: a semiconductor chip; a resin package which seals the semiconductor chip; signal passages which guide the signal terminals of the semiconductor chip outward from the resin package; a grounding metal film in contact with the bottom surface of the semiconductor chip; and a grounding passage which is connected to the grounding metal film and guided outward from the resin package.

Semiconductor device and method of producing the same

There is provided a method for fabricating semiconductor devices including resin packages sealing semiconductor elements and external connection terminals respectively resin projections formed on the resin packages and metallic film parts provided to the resin projections. The semiconductor elements are mounted to a lead frame having recess portions located in positions corresponding to positions of the resin projections, metallic film parts being provided in the recess portions. The semiconductor elements are electrically connected to the metallic film parts. The resin packages that seal the semiconductor elements and gate portions are integrally formed with the resin packages. The lead frame is etched so that the resin packages are separated from the lead frame together with the metallic layer parts. The resin packages are attached to an adhesive tape provided to a frame and being used as a carrier.

Method and apparatus for fabricating semiconductor device

Growing community of inventors

Satsuma-gun, Japan

Masafumi Tetaka