Central Glass Company, Limited

International Business Machines Corporation

Masafumi Oda

Junya Nakatsuji

Kazuhiro Yamanaka

Young-Hye Na

Jangwoo Kim

Katsutoshi Suzuki

Kazunari Takeda

Tsuyoshi Ogawa

Maxwell Giammona

Tsubasa Itakura

Makoto Seino

Yutaka Sugita

Sho Yamazawa

A rechargeable metal halide battery with an optimized active cathode electrolyte solution has high energy density and does not require charging following fabrication. The optimized active cathode electrolyte solution includes (i) a mixture of a metal halide and its corresponding halogen dissolved in an organic solvent at a concentration ratio greater than 0.5 and (ii) an oxidizing gas. The organic solvent is a nitrile-based compound and/or a heterocyclic compound. Glyme may be added to the organic solvent to improve battery performance.

Liquid cathode formulation for rechargeable metal halide battery

A positive photosensitive resin composition according to the present invention contains at least (A) a polysiloxane compound having at least a structural unit of the general formula (1), (B) a photoacid generator or quinone diazide compound and (C) a solvent[(R)RSiO]&#x2003;&#x2003;(1)where Rrepresents the following group; Reach represents a hydrogen atom, C-Calkyl group, phenyl group, hydroxy group, C-Calkoxy group or C-Cfluoroalkyl group; b represents an integer of 1 to 3; m represents an integer of 0 to 2; n represents an integer of 1 to 3; and b, m and n satisfy b+m+n=4, where X each represents a hydrogen atom or acid labile group; and a represents an integer of 1 to 5. It is possible by the use of this positive photosensitive resin composition to provide a film with high resistance and heat-resistant transparency and provide an electronic component with such a film.

Positive photosensitive resin composition, method for producing film using same, and electronic component

According to one aspect of the present invention, there is provided a curable resin composition including at least: a polysiloxane compound having, in a molecule thereof, at least two functional groups selected from the group consisting of silanol groups and alkoxysilyl groups as a component (A-1); and silica whose extract water has a pH of 6.1 or lower at 25&#xb0; C. as a component (B), wherein the amount of the component (B) relative to the total amount of the components (A-1) and (B) is in a range of 70 to 97 mass %. This curable resin composition is able to, even when formed into various shapes and sizes, prevent foaming during curing and thus is suitable as an encapsulant material for a semiconductor element.

Curable resin composition, cured product thereof, and semiconductor device using the same

Growing community of inventors

Fujimi, Japan

Masafumi Oda