Nichia Corporation

Kaneka Corporation

Daicel Corporation

Asahi Kasei Chemicals Corporation

Masafumi Kuramoto

Satoru Ogawa

Tomohisa Kishimoto

Teppei Kunimune

Tomohide Miki

Katsuaki Suganuma

Tomoya Tsukioka

Keun-Soo Kim

Miki Niwa

Masaki Hayashi

Daisuke Iwakura

Shuji Shioji

Hirofumi Ichikawa

Yasunori Shimizu

Toshifumi Imura

Hiroki Inoue

Tomoki Tanisada

Katsuyuki Tsunano

Hiroto Tamaki

Katsuya Ouchi

Masanobu Sato

Yasunobu Nakagawa

Masahito Ide

Akihiro Ota

Motohisa Kitani

Manabu Tsumura

Takayuki Sano

Takeshi Yoshida

Masahide Bando

Akiko Yamasaki

Kenji Ozeki

Koji Abe

Kazunori Terada

Kazuhiko Hashimoto

Satoshi Okada

Tomoaki Tsuruha

Yuji Okada

Yu Higuchi

Ikuya Nii

Takuma Arikawa

Daisuke Niki

A method of impregnating voids of a sintered metal body having a porous structure with resin, the method comprising preparing a resin material that contains a defoamer containing hydrophilic or hydrophobic particles, defoaming the prepared resin material by reducing pressure of the resin material, applying the defoamed resin material onto a surface of the sintered metal body, impregnating the voids with the resin material by reducing pressure of the sintered metal body and the resin material applied to the surface of the sintered metal body so as to expel gas from the voids; and curing the resin material by heating.

Resin impregnation method, method of manufacturing wavelength-conversion module, and wavelength-conversion module

A wavelength conversion member containing a fluorescent material having, for example, a perovskite-type structure maintained with high light emission intensity; a light emitting device; and a method for producing a wavelength conversion member. The wavelength conversion member includes a translucent member containing a resin, a wavelength conversion layer containing a fluorescent material having, for example, a perovskite-type structure, and a composition of ABX, and a first intermediate layer between the translucent member and the wavelength conversion layer. The method for producing a wavelength conversion member includes forming a first intermediate layer on a surface of a first translucent member containing a resin, and forming a first wavelength conversion layer containing a first fluorescent material having, for example, a perovskite-type structure on a surface of the first intermediate layer.

Wavelength conversion member, light emitting device, and method for producing wavelength conversion member

Fluorescent material composite particles include translucent inorganic particles having a volume average particle diameter in a range of 30 nm or more and 500 nm or less, fluorescent nanoparticles having an average particle diameter in a range of 5 nm or more and 25 nm or less, and a first resin. At least a part of each of the translucent inorganic particles are embedded in the first resin. The translucent inorganic particles are unevenly distributed to a surface of the fluorescent material composite particles. The fluorescent material composite particles have a volume average particle diameter in a range of 0.5 μm or more and 50 μm or less.

Fluorescent material composite particles, wavelength converting member, light emitting device, method for producing fluorescent material composite particles, and method for producing wavelength converting member

There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm and further contains an anionic surfactant but is substantially free from resin.

Metal powder sintering paste and method of producing the same, and method of producing conductive material

Provided is a curable resin composition which can be cured to form a material (cured product) that has low tack properties and resists adhesion of garbage. The present invention provides a curable resin composition comprising polysiloxane (A) having not less than 2 alkenyl groups in the molecule and polysiloxane (B) having not less than 2 hydrosilyl groups in the molecule, wherein (T+Q)/D>0.3 and M+D+T+Q=1 are satisfied regarding all silicon atoms contained therein, the amount of the hydrosilyl groups with respect to 1 mol of aliphatic carbon-carbon double bonds present therein is 0.9 to 5.0 mol, and a cured product of the curable resin composition exhibits a separation strength of not more than 0.40 N per mmin separation load evaluation and/or a total separation load of not more than 0.018 N·mm per mm.

Curable resin composition, method for producing curable resin composition, and method for measuring surface tackiness of viscoelastic material

A method of producing an electrically conductive material includes hardening, at a temperature in a range of 120&#xb0; C. to 300&#xb0; C., an electrically conductive adhesive that constitutes: (A) a polyether polymer having a backbone of a repeating unit of the formula &#x2014;R&#x2014;O&#x2014;, wherein Ris a hydrocarbon group having 1 to 10 carbon atoms and an end group which is a hydrolyzable silyl group; and (B) silver particles.

Electrically conductive adhesive and electrically conductive material

An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 &#x3bc;m to 15 &#x3bc;m, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 &#x3bc;m to 15 &#x3bc;m in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150&#xb0; C. to 320&#xb0; C., so as to obtain a conductive material.

Method for producing an electronic device

A silicone resin composition includes a silicone resin and a ceria-zirconia solid solution, with the solid solution being contained in a range of 0.01 to 2 parts by mass relative to 100 parts by mass of the silicone resin.

Silicone resin composition and method of producing same

There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 &#x3bc;m to 5 &#x3bc;m and further contains an anionic surfactant but is substantially free from resin.

The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting devicebased on GaN which emits blue light, the first resin moldingwhich integrally molds the first leadwhereon the light emitting deviceis mounted and the second leadwhich is electrically connected to the light emitting device, and the second resin moldingwhich contains YAG fluorescent material and covers the light emitting device. The first resin moldinghas the recesscomprising the bottom surfaceand the side surfaceformed therein, and the second resin moldingis placed in the recess. The first resin moldingis formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin moldingis formed from a thermosetting resin such as silicone resin.

Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same

A light-emitting device includes: a light-emitting element including a first surface provided as a light extraction surface, a second surface opposite to the first surface, a plurality of third surfaces between the first surface and the second surface, and a positive electrode and a negative electrode at the second surface; a light-transmissive member disposed at the first surface; and a bonding member disposed between the light-emitting element and the light-transmissive member and covering from the first surface to the plurality of third surfaces of the light-emitting element to bond the light-emitting element and the light-transmissive member. The bonding member is made of a resin that contains nanoparticles. The nanoparticles have a particle diameter of 1 nm or more and 30 nm or less and a content of 10 mass % or more and 20 mass % or less.

Light-emitting device

A light emitting device includes a light emitting element, a substrate which contains a conductive member containing silver having the light emitting element mounted, and a sealing member which covers the light emitting element, and the sealing member is made of a cured silicone composite containing the following components (A), (B), (C), and (D): In the formula (1), Rto Reach independently represent a linear, branched, or cyclic monovalent hydrocarbon group having 1 to 10 carbon atoms, which may be substituted by a fluorine atom, or each independently represent a hydroxy group or an alkoxy group; and m represents an integer of 1 or greater.

Light emitting device

A light-emitting device includes a package having a recessed portion defined by a bottom surface and lateral walls surrounding the bottom surface, first and second light-emitting elements aligned in the longitudinal direction on the bottom surface, and a wavelength conversion member in the recessed portion, the wavelength conversion member converting light from the first light-emitting element. The first and second light-emitting elements each have a polygonal shape other than a rectangular shape in a front view. The first and second light-emitting elements are disposed away from each other so that a longest side of each light-emitting element will be substantially parallel to the longitudinal direction of the bottom surface and so that sides facing each other will be substantially parallel to each other. The wavelength conversion member is disposed at least in a region on the bottom surface between the first and second light-emitting elements.

Light-emitting device and backlight

Disclosed is an electrically conductive adhesive containing: (A) a polyether polymer having a backbone comprising a repeating unit of the formula: &#x2014;R&#x2014;O&#x2014; wherein Ris a hydrocarbon group having 1 to 10 carbon atoms, and an end group which is a hydrolyzable silyl group, and (B) silver particles. Further disclosed is an electrically conductive material which is a hardened product of the electrically conductive adhesive.

Growing community of inventors

Tokushima, Japan

Masafumi Kuramoto