Ube Industries, Inc.

Masafumi Kohda

Hiroaki Yamaguchi

Masato Murakami

Nobuharu Hisano

Ryoichi Sato

Yukio Kaneko

Shuichi Hashiguchi

Keita Bamba

Tadahiro Yokozawa

Taizou Murakami

Toru Miura

A method for forming a conductor layer, including subjecting a surface of a polyimide film where a polyimide layer (a) is formed to polyimide etching treatment, to remove at least part of the polyimide layer (a), the polyimide film having the polyimide layer (a) formed on one surface or both surfaces of a polyimide layer (b); and then forming a conductor layer on the surface, such that the polyimide etching treatment time T (min), which is represented using t (min) defined by the formula as described below, is within the range of 0.2t&#x2264;T&#x2264;5t. 

Method for forming conductor layer, and method for producing multilayer wiring substrate using same

A polyimide film, which is produced by the reaction of a tetracarboxylic acid component comprising 3,3',4,4&#x2032;-biphenyltetracarboxylic dianhydride as the main component and a diamine component comprising p-phenylenediamine as the main component, is heated at a temperature of from 460&#xb0; C. to 550&#xb0; C., and then water or an alkaline aqueous solution is sprayed on a surface of the polyimide film for surface treatment, thereby improving adhesiveness, while maintaining the excellent properties inherent in the polyimide film.

Polyimide film and process for producing polyimide film

Disclosed is a polyimide foam made of an aromatic polyimide composed of a tetracarboxylic acid component, which is composed of 0 to 90% by mole of a 3,3',4,4&#x2032;-biphenyltetracarboxylic acid component and 100 to 10% by mole of a 3,3&#x2032;,4,4&#x2032;-benzophenone tetracarboxylic acid component and/or a 2,3,3&#x2032;,4&#x2032;-biphenyltetracarboxylic acid component, and a diamine component, which is composed of 50 to 97% by mole of m-phenylenediamine and 50 to 3% by mole of 4,4&#x2032;-methylenedianiline. The polyimide foam can be produced easily, has uniform and fine cells, and has the mechanical properties required for practical use as a foam, such as flexibility that prevents the foam from cracking easily even when deformed and excellent cushioning properties, as well as heat resistance that can resist use at high temperatures.

Polyimide foam and method for producing same

A polyimide wherein a tetracarboxylic dianhydride including 3,3',4,4&#x2032;-phenyltetracarboxylic dianhydride as the essential component is the starting tetracarboxylic dianhydride component, and an amine comprising between 0.5 and 30 mole percent of a diamine represented by the following general formula is the starting diamine component. (wherein A is a direct bond or a crosslinking group, and R-Reach represent a substituent). It is possible to obtain a polyimide, a polyimide film and a laminated body with an improved adhesion property and an improved moisture permeation rate, even without surface treatment, comprising, as the essential tetracarboxylic dianhydride, 3,3&#x2032;,4,4&#x2032;-biphenyltetracarboxylic dianhydride which has conventionally only yielded polyimides with low adhesive strength.

Polyimide, polyimide film and laminated body

An atomic oxygen-resistant film comprising an atomic oxygen-resistant film formed on a polyimide film, wherein the mass reduction rate thereof is no greater than 1.0% when irradiated with atomic oxygen at an irradiation dose of appromixately 3&#xd7;10atoms/cmat a speed of about 8 km/sec.

Atomic oxygen-resistant film

A solventless non-filler underfill material for COF mounting comprising an organic material, which is used to fill the gap between an FPC having a polyimide film substrate and a copper circuit layer having a thickness of 9 &mgr;m or smaller and an IC chip mounted on the FPC, exhibits such adhesion as to destroy a silicon wafer in a polyimide film/silicon wafer adhesion test, and provides a cured film having a tensile modulus of 150 kg/mm or less.

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Ichihara, Japan

Masafumi Kohda