Ube Industries, Inc.

Masafumi Hashimoto

Toshihiko Anno

Toshiyuki Nishino

Hiroaki Yamaguchi

Kohji Narui

Takeshi Uekido

Takuro Kochiyama

A copper-clad laminate is prepared by laminating a copper foil on one side or both sides of a polyimide film by thermocompression bonding. The flexibility of the copper-clad laminate is remarkably improved by employing a polyimide film having a thickness of 5 to 20 &#x3bc;m and a copper foil having a thickness of 1 to 18 &#x3bc;m.

Copper clad laminate

An adhesion-enhanced polyimide film which includes a core layer composed of a polyimide (a) having high rigidity and a low linear expansion coefficient, at least one side of which has a thin-layer formed by heating a coated layer including a heat-resistant surface treatment agent and a polyimide precursor which yields a highly heat-resistant amorphous polyimide (B).

Adhesion-enhanced polyimide film, process for its production, and laminated body

An easily slidable polyimide film having a polyimide surface layer comprising a polyimide which is thermoplastic and has a glass transition temperature of 190&#x2013;450&#xb0; C., wherein there are dispersed in the polyimide of the polyimide surface layer, in a proportion of approximately 0.5&#x2013;10 mass % based on the polyimide of the polyimide surface layer, wholly aromatic polyimide particles made of a polyimide comprising at least 80 mass % of a pyromellitic acid component and a p-phenylenediamine component, and having a median size of 0.3&#x2013;0.8 &#x3bc;m and a maximum size of no greater than 2 &#x3bc;m, in at least about 1 &#x3bc;m of the polyimide surface layer.

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Ube, Japan

Masafumi Hashimoto