Asahi Glass Company, Limited

Agc Inc.

Masabumi Ito

Hiroshi Kojima

Koji Otsuka

Takashi Sugiyama

Mitsuru Watanabe

Jun Ito

Keisuke Kato

Yoshiaki Ikuta

Kenji Okamura

Motoshi Ono

Hiroyuki Tomonaga

Noriaki Shimodaira

Hitoshi Mishiro

Kazuhiko Ishimura

Yoichi Ozawa

Masahiro Deguchi

Mitsuru Horie

Ikuo Nagasawa

Itsuro Watanabe

Hiroyuki Ezura

Yukihiro Iwata

Akihisa Ishino

A glass plate structure includes: a glass plate having first and second major surfaces; an antireflection film; and a print portion. The first major surface includes: a curved surface region that is a region of an end portion of the glass plate, is curved convexly, and has a radius of curvature r that is 50% or more of a thickness t of the glass plate; and a flat surface region that is connected to the curved surface region. The antireflection film is a laminate in which a high refractive index layer and a low refractive index layer are laminated alternately. The number of layers of the antireflection film is 12 or smaller. A total thickness of the antireflection film in the flat surface region is 400 nm or smaller. A thickness of an outermost layer of the antireflection film in the flat surface region is 90 nm or larger.

Glass plate structure and on-vehicle display device

A machining apparatus for a curved plate includes a holder that holds a main surface of a curved plate having curved surfaces on both main surfaces; a machining device that machines an outer circumference of the curved plate held by the holder; a movable frame that retains the machining device; a driver that moves the movable frame to move a machining point of the curved plate held by the holder; a controller that controls the driver; and a guide that guides the movable frame along the outer circumference of the curved plate held by the holder.

Curved plate machining apparatus, and method of manufacturing curved plate with machined outer circumference

The present invention relates to a low expansion glass substrate which serves as a substrate of a reflective mask used in a lithography step of semiconductor production steps, wherein two side surfaces positioned to face each other among side surfaces formed along a periphery of the low expansion glass substrate, each have a flatness of 25 &#x3bc;m or less.

Low expansion glass substrate for reflection type mask and method for processing same

The present invention is to provide a method for smoothing the optical surface having a concave defect of an optical component for EUVL. The present invention relates to a method for smoothing the optical surface of an optical component for EUVL, comprising irradiating, with an excimer laser having a wavelength of 250 nm or less with a fluence of 0.5 to 2.0 J/cm, the optical surface having a concave defect of an optical component for EUV lithography (EUVL), the optical component being made of a TiO-containing silica glass material comprising SiOas a main component.

Optical component for EUVL and smoothing method thereof

The present invention is to provide a processing method for manufacturing a highly flat and highly smooth glass substrate with good productivity. A highly flat and highly smooth glass substrate is obtained with good productivity by processing of a glass substrate, which comprises a step of measuring the surface shape of the glass substrate prior to processing, a step of processing the surface of the substrate by changing a processing condition for each site (first processing step), and a step of finish-polishing the surface of the glass substrate that has been subjected to the first processing step (second processing step). At that time, the processing condition for each site within the surface of the substrate in the first processing step is determined from a processing amount that is determined from the concave-convex shape of the surface of the glass substrate prior to processing and the in-plane distribution of a processing amount by the second processing step separately measured by using a similar substrate.

Processing method of glass substrate, and highly flat and highly smooth glass substrate

An object of the present invention is to provide a polishing method for diminishing concave defects of a glass substrate used in a reflective mask for EUVL and the like. The invention relates to a method of polishing a glass substrate which comprises polishing a major surface of the glass substrate while feeding a polishing slurry between the glass substrate and a pad surface of a polishing pad, wherein the polishing load of the polishing pad is from 1 to 60 g/cm. The pad surface of the polishing pact is preferably dressing-processed.

Method of polishing glass substrate

Spots generated on a glass substrate after a polishing step are reduced. The present invention relates to a method for polishing a glass substrate including injecting a silica abrasive and a high-boiling solvent in a final glass substrate polishing step. The high-boiling solvent is preferably a solvent having a molecular weight of 300 or lower and a boiling point of 150&#xb0; C. or higher. As Examples of the high-boiling solvent having a molecular weight of 300 or lower and a boiling point of 150&#xb0; C. or higher includes ethylene glycol, propylene glycol and glycerine.

Method for polishing glass substrate and process for producing glass substrate

The present invention aims at providing a glass substrate required to have a surface polished with extremely high accuracy as in glass substrates for reflective masks for use in EUVL; and a polishing method for producing the glass substrate. The present invention provides a glass substrate for mask blank, which is a glass substrate comprising SiOas a main component and having a polished main surface, wherein concave defects and convex defects on the main surface have a depth of 2 nm or smaller and a height of 2 nm or smaller, respectively, and have a half-value width of 60 nm or smaller, so that the concave defects and/or the convex defects do not cause phase defects when the glass substrate is used to produce a mask for exposure and the mask is used. Also disclosed are a polishing method for producing the glass substrate, and a mask blank and a mask for exposure using the glass substrate.

Glass substrate for mask blank and method of polishing for producing the same

There is provided a process for smoothing a substrate surface having a concave defect, such as a pit or a scratch. A process for smoothing a surface of a glass substrate for a reflective mask blank used in EUV lithography, comprising disposing a thin film on a glass substrate; detecting a concave defect existing on the glass substrate; and locally heating or locally anodizing a portion of the thin film just above the detected concave defect to perform a chemical reaction accompanied by a volume increase in a material forming the thin film.

Process for smoothing surface of glass substrate

A process for polishing a glass substrate, which enables to polish a glass substrate having a large waviness formed by mechanical polishing, to have a surface excellent in flatness, is provided. A process for polishing a glass substrate, comprising a step of measuring the surface profile of a mechanically polished glass substrate to identify the width of waviness present in the glass substrate, and a step of applying dry etching using a beam having a beam size in FWHM (full width of half maximum) value of at most the above size of waviness, to polish the surface of the glass substrate.

Process for polishing glass substrate

A low-expansion glass substrate for a reflective mask, wherein the glass substrate is suited for a base material of a reflective mask employed in a lithographic process in semiconductor fabrication, comprises a lateral surface, a chamfered portion and a notched portion formed along an outer periphery thereof, at least one of the lateral surface, the chamfered portion and the notched portion being provided with a mirror-finished surface.

Low-expansion glass substrate for a reflective mask and reflective mask

A process for polishing a glass substrate required to have high-degree of flatness and smoothness, is provided. A preliminarily polished glass substrate is applied with a surface treatment by a first-step gas-cluster ion beam etching to improve the flatness, and then, the glass substrate is applied with a surface treatment by a second-step gas-cluster ion beam etching having different irradiation conditions of those of the first-step gas-cluster ion beam etching to improve the surface roughness, whereby the glass substrate is finish-polished to have a flatness of at most 0.05 &#x3bc;m and a surface roughness (Rms) of at most 0.25 nm.

A plurality of glass plates 10 are stacked in a block form without forming gaps between adjacent glass plates while the stacked glass plates are separable; the stacked glass plates are cut off in a circular shape or a doughnut-like shape in a block; and then, the processed glass plates are separated. According to this method, tipping which may result when glass plates are processed individually can be prevented whereby processing is easy, and productivity is improved.

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Tokyo, Japan

Masabumi Ito