Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Corporation

Mitsubishi Denki K.k.

Masaaki Taruya

Mitsuru Koiwa

Takafumi Hara

Shinsuke Asada

Kazuhiro Watanabe

Nobuyuki Sawazaki

Seizo Fujimoto

Takeshi Shimizu

Shigemi Murata

Tetsushi Watanabe

Toshio Maekawa

Hiroshi Kobayashi

Masao Akiyoshi

Shuichi Ueno

Katsuya Tsujimoto

Eiji Yoshikawa

Kazuhiro Tada

Mitsuo Sone

Kiyoshi Ookawa

Yoshiyuki Deguchi

Dai Yoshii

Yosuke Tsuzaki

Yoshimitsu Takahata

Masao Kanatani

Yuji Kawakami

Satoru Fukagawa

Koji Waki

Shin Uegaki

Tatsuya Kitagawa

The semiconductor device includes: a semiconductor element including a body portion formed in a plate shape, a protection film provided at an outer periphery on one surface of the body portion, and a metal thin film provided adjacently to an inner side of the protection film on the one surface of the body portion; a metal member joined to a surface of the metal thin film on a side opposite to the body portion, by solder; and a mold resin sealing the semiconductor element and the metal member, wherein the surface of the metal thin film on the side opposite to the body portion has, on at least a part of an outer periphery thereof, a projection portion projecting from the surface of the metal thin film, and the solder is not provided on an outer peripheral side from a top of the projection portion.

Semiconductor device and manufacturing method therefor

In a current detection apparatus, one or more first plate portions, one or more second plate portions, and one or more third plate portions of one or more magnetic shields are opposed to side surfaces of the one or more protrusions. The one or more protrusions, the one or more magnetic field detection elements, and one or more conductive members are respectively surrounded by the one or more magnetic shields, respectively. Consequently, the current detection apparatus is downsized and has high current detection accuracy.

Current detection apparatus and power conversion apparatus

A resin welded body where a first resin part that is absorbent with respect to laser light and a second resin part that is transparent with respect to laser light are fitted together and the laser light is emitted to a predetermined position from the side of the second resin part to weld together the first and the second resin parts and form a joint portion between both resin parts, wherein on either the first or the second resin part there is disposed a projection that comes into contact with the other resin part during the welding and regulates the sinking amount at the joint portion.

Resin welded body and manufacturing method thereof

A bridge rectifier circuit, which takes control of a current flowing through an armature winding of a motor-generator and a battery, includes rectifier elements each made of a MOSFET; phase current detection means that detect the amount and the direction of current flowing between the drain and the source of the FET; and a control means that takes on/off control of the FET by applying a control voltage between the gate and the source thereof; wherein when the phase current detection means detect a reverse current flowing through the FET exceeding a first predetermined value, the control means applies a control voltage between the gate and the source of the FET so as to turn on the FET.

Bridge rectifier circuit

The idle-stop restart control system includes: a sensorless synchronous motor-generator which operates as a generator and a starting motor; an induced-signal detecting circuit for detecting an induced signal output from an armature winding; a field drive circuit for controlling energization of a field winding; and a restart control circuit output, to the field drive circuit, a drive signal for controlling the energization of the field winding to amplify the induced signal while calculating the number of revolutions and an angular position of a rotor based on the detected induced signal when an engine stop command is input and a level of the detected induced signal is equal to or less than a predetermined value and output the drive signal for controlling the energization of the armature winding to restart the engine based on the calculated number of revolutions and angular position of the rotor when a restart command is input.

Idle-stop restart control system

A welding method and welding apparatus for resin members is provided in which dimensional accuracy of two resin members after welding can be secured and reduction in joining strength due to excessive laser irradiation can be prevented. In a method of superimposing a resin having a laser-transmitting property and a resin having laser absorptiveness and irradiating the resin members with a laser beam from the side of the laser-transmitting resin member to deposit the resin members on each other, irradiation with the laser beam is ended in accordance with reduction in the approaching speed of the two resin members during the irradiation with the laser beam.

Welding method and welding apparatus for resin member

A method for producing a welded resin material contains steps of: superimposing a resin member having transmissibility to laser light and a resin member having absorptivity to laser light to form a contact part where the resin members are in contact with each other; forming a closed space that is adjacent to the contact part and faces one end of the contact part; and radiating the laser light from the resin member having transmissibility while pressing the resin members to each other through the contact part, so as to heat the contact part to melt a resin at the contact part, housing a resin excluded from the contact part through melting in the closed space, solidifying the resin melted at the contact part to weld the resin members.

Welded resin material

A semiconductor pressure sensor is provided with a semiconductor pressure sensor part that converts a pressure to an electrical signal, a sensor module in which said semiconductor pressure sensor part and a terminal of which part is extended to the outside are insert-molded with a first resin, and an outer case in which said sensor module is contained, and said sensor module is further insert-molded with a second resin to form a connector portion, and the semiconductor pressure sensor is characterized in that the exposed portion of the sensor module from the second resin, and the boundary between the exposed portion of the sensor module and the second resin are covered with an adhesive.

Semiconductor pressure sensor, manufacturing method thereof, and die for molding semiconductor pressure sensor

An SOI substrate includes a thin diaphragm portion that is formed by removing a portion of the substrate from a rear surface side, and a thick outer frame portion that surrounds the diaphragm portion. A piezoresistive element that outputs an electrical signal in response to pressure is formed on the diaphragm portion, and an electrode that extracts the electrical signal from the piezoresistive element is formed on the outer frame portion. The electrode is disposed at a position on the outer frame portion that is separated by greater than or equal to 100 &#x3bc;m from a boundary line between the diaphragm portion and the outer frame portion.

Semiconductor strain sensor

Semiconductor pressure sensor and die for molding a semiconductor pressure sensor

A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The semiconductor pressure sensor includes a package () made of a resin and having a concave portion (), a lead () formed integral with the package () by insert molding, with its one end exposed into the concave portion () and its other end extended from the package () to the outside, a sensor chip () arranged in the concave portion () for detecting pressure, and a bonding wire () electrically connecting the sensor chip () and the lead () with each other. An interface between the lead () and the package () on the side of the concave portion () is covered with a first protective resin portion () of electrically insulating property, and the bonding wire () is covered with a second protective resin portion () that is softer than the first protective resin portion ().

Semiconductor pressure sensor

A semiconductor pressure sensor is not influenced by a charged object in a fluid to be measured or an electric field from the outside, so satisfactory sensitivity and accuracy can be ensured. The semiconductor pressure sensor is provided with a diaphragmthat responds to the pressure of the fluid to be measured. The diaphragm includes a silicon substrate with piezoresistive elements, which together constitute a bridge circuit, being embedded therein, and a shield film for electromagnetic shielding formed on a surface of the silicon substrate at a side thereof at which the fluid to be measured is in contact with the silicon substrate. The shield film is electrically connected to the silicon substrate so as to have the same potential as that of the silicon substrate.

A semiconductor pressure sensor is intended to achieve reduction in size and cost by decreasing the number of terminals and the number of pads. In the semiconductor pressure sensor, in a first mode in which correction data is input to a memory, a voltage input change-over switch and an input/output change-over switch are operated by an input signal from a switch change-over terminal in such a manner that a voltage input terminal and an input/output terminal are connected to a digital circuit, whereas in a second mode in which an electric signal corrected and amplified is output, the voltage input change-over switch is connected to a semiconductor sensor chip by means of an input signal from the switch change-over terminal, and the input/output terminal is connected to a correction and amplification circuit.

A pressure sensor is provided which is tolerant to noise such as electromagnetic waves, is configured so as to be capable of easily selecting a system environment in which a sensor signal, commonly used for various kinds of systems, can be freely read in at timing as required by a system, and is able to realize reduction in size and cost suitable for automotive use. An element portion for detecting pressure and a circuit portion having a signal processing function are integrally accommodated in the same package. An interface section optimized to interface with external wiring, an A/D conversion section for digitally encoding an analog processed detection signal of the sensor, and a digital processing section for converting the digitized signal into a desired serial signal are added to the circuit portion . The entire circuit portion is constituted by at most two ICs alone, and a selection can be made between two output forms including an analog processed detection signal and a digital processed detection signal.

Pressure sensor

An angular velocity sensor device that is produced in a simplified manufacturing process and at a reduced manufacturing cost. The angular velocity sensor device includes a first beam which extends along the surface of the substrate and to which a vibration driving source imparts a vibration in an X-axis direction along the surface of the substrate, and a second beam which follows an elliptical trajectory along the surface of the substrate in response to the resultant force of the force in the X-axis direction and a Coriolis force acting in an Y-axis direction perpendicular to the X-axis direction along the surface of the substrate.

Growing community of inventors

Tokyo, Japan

Masaaki Taruya