Sharp Kabushiki Kaisha Corporation

Masaaki Ooga

Yasunobu Tagusa

Keiji Aota

Katsunori Nagata

Shinichi Sugimoto

Toshihiko Nakagawa

A mounting apparatus includes: a heater head for bonding a liquid crystal display and a flexible printed circuit board by thermocompression; a cylinder as a heater head driving means for driving heater head to compress the liquid crystal display and flexible printed circuit board by a prescribed load; and a control mechanism as a stretch amount controlling means for adjusting a load change per unit of time after the heater head starts compressing the flexible printed circuit board by the cylinder as well as a time at which a required load is attained to control the stretch amount of the flexible printed circuit board by thermocompression. Preferably, the mounting apparatus is provided with a mechanism which performs measurement after preliminary bonding and which performs regular bonding while controlling based on the obtained information.

Mounting apparatus and mounting method

A flexible wiring board is adapted to be connected with a circuit board by means of an anisotropic conductive film. A flexible substrate of the flexible wiring board is mounted with an integrated circuit and has a generally rectangular connection portion. The connection portion includes a first edge of the substrate and parts of second and third edges adjoining the first edge of the substrate. A plurality of connection terminals are provided in the connection portion of the substrate. These connection terminals extend perpendicular to and arranged along the first edge of the substrate. Opposite end parts including the parts of the second and third edges of the connection portion do not extend beyond the connection terminals located closest to the second and third edges, respectively.

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Matsuzaka, Japan

Masaaki Ooga