Tokyo Seimitsu Co., Ltd.

Tosei Engineering Corporation

Masaaki Oguri

Takao Inaba

Kenji Sakai

Minoru Numoto

Nozomi Takai

Hisashi Terashita

In a measuring apparatus, a plurality of design values in design values substituted in the correction computation equations for correcting a geometrical measurement error inherent in the measuring apparatus are set as variables, the variables are optimized by a numerical solution to obtain optimized correction computation equations. A measured value is computed by using the optimized correction computation equations obtained. For optimization of the variables, a master work is measured and the variables are adjusted so that a measurement error is minimized.

Measuring method and measuring apparatus

A digital measuring head in a measuring apparatus measures a work by making a contact element abut to the work. The digital measuring head includes an arm supported rotatably around a support point arranged on a base; a finger having the contact element at a tip end and mounted to a tip end portion of the arm; and a scale and a read head, one of which is provided at a rear end portion of the arm and the other of which is arranged on the base. Displacement of the contact element which contacts with the work is measured with the scale and the read head. Thereby, the measuring head can perform measurement in a wide range and becomes excellent in the actuation property and the temperature property, and masters for calibration of an indicated dimension are only used at an initial adjustment time.

Digital measuring head

A semiconductor wafer is held by a wafer mount plate, which is loosely inserted into a housing. An air chamber is formed between the wafer mount plate and the housing. A retainer ring encloses the semiconductor wafer, and the semiconductor wafer as well as the retainer ring contacts with a polishing pad. An roughness is formed at the bottom of the retainer ring so as to dress the polishing pad. Polishing liquid is supplied to the inside of the retainer ring. Thus, the polishing pressure can be uniformly applied and the polishing liquid can be uniformly supplied on the whole surface of the semiconductor wafer, and the polishing for the semiconductor wafer and the dressing for the polishing pad can be performed at the same time.

Wafer polishing machine

A wafer mount plate is inserted loosely into a housing, and the wafer mount plate is supported in such a manner as to be swingable and movable vertically and horizontally with respect to a polishing pad. An air chamber is formed between the wafer mount plate and the housing. By controlling the internal pressure of the air chamber, it is possible to control polishing pressure applied on the wafer mount plate. Since the entire top side of the wafer mount plate can be uniformly pressured, the uniform polishing pressure can be applied on the entire surface of the semiconductor wafer. Further, the wafer mount plate inclines in accordance with variations in the inclination of the polishing pad so that the semiconductor wafer and the polishing pad can be maintained in a parallel position.

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Mitaka, Japan

Masaaki Oguri