Lsi Logic Corporation

Nomura Micro Science Co., Ltd.

Masaaki Ogitsu

Osamu Ito

Nobuyoshi Nambu

Mitsugu Abe

Hiroshi Mizuno

Kazuo Inomata

Toru Kikuchi

Takuya Nagamine

Osamu c/o Chubu Chelest Co Ltd Ito

Nobuyoshi c/o Chubuchelest Co Ltd Nambu

Mitsugu c/o Nomura Micro Science Co Ltd Abe

Kazuo c/o Nitivy Company Limited Inomata

A material for purification of a semiconductor polishing slurry that without changing of pH value, is capable of efficiently purifying a polishing slurry to thereby not only prevent metal contamination of a polished object as effectively as possible but also achieve recycling of a polishing slurry without any problem; a relevant module for purification of a semiconductor polishing slurry; and a process for purifying a semiconductor polishing slurry with the use thereof. In particular, a material for purification of a semiconductor polishing slurry characterized in that it comprises a fibrous substrate having a functional group capable of forming a metal chelate or such a functional group together with hydroxyl fixed onto at least the surface thereof. This material for purification of a semiconductor polishing slurry is, for example, used in such a manner that it is inserted in a container fitted with polishing slurry inflow port and outflow port while ensuring passage of polishing slurry flow.

Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry

A polishing table in the CMP apparatus has a diameter smaller than the diameter of a polishing pad The polishing pad is disposed on the polishing table so as to cover the entire top surface of the polishing table A space is formed between outside of the outer peripheral surface of the polishing table and under the outer peripheral bottom surface portion of the polishing pad projecting outside from the edge of the polishing table A trough with an opening on top thereof as a device for withdrawing the used slurry is disposed around the outer peripheral surface of the polishing table so as to be located a part thereof in the space

CMP slurry recycling apparatus and method for recycling CMP slurry

Growing community of inventors

Tsukuba, Japan

Masaaki Ogitsu