Ulvac, Inc.

Harima Chemicals, Incorporated

Denso Corporation

Tohoku University

Shinkawa Ltd.

Jemco Inc.

Seiko Epson Corporation

Masaaki Oda

Toshimitsu Hirai

Noriyuki Abe

Yorishige Matsuba

Yoshihisa Misawa

Toshihiro Suzuki

Toru Maeda

Akinobu Teramoto

Masahiro Furusawa

Norimichi Saito

Masashi Totokawa

Masayuki Ueda

Hideyuki Goto

Hideyuki Gotoh

Katsuhisa Osako

Reiko Kiyoshima

Katsuhisa Oosako

Toshiharu Hayashi

Tsutomu Atsuki

Tetsuro Tanikawa

Katsuhisa Tsukuba Research Laboratory Oosako

Masayuki Tsukuba Research Laboratory Ueda

Yorishige Tsukuba Research Laboratory Matsuba

Yoshihisa Tsukuba Research Laboratory Misawa

Hideyuki Tsukuba Research Laboratory Goto

Kyuukou Tei

Hiiroyuki Nihon Shinku Gijutsu KK Yamakawa

Hirohiko Nihon Shinku Gijutsu KK Murakami

Hideo c/o Ulvac Inc Takei

Sadayuki c/o Ulvac Inc Ukishima

Hiroshi Yamaguchi

Satoru c/o Ulvac Inc Ishibashi

Metal nanoink () for bonding an electrode of a semiconductor die and an electrode of a substrate and/or bonding an electrode of a semiconductor die and an electrode of another semiconductor die by sintering under pressure is produced by injecting oxygen into an organic solvent () in the form of oxygen nanobubbles () or oxygen bubbles () either before or after metal nanoparticles () whose surfaces are coated with a dispersant () are mixed into the organic solvent (). Bumps are formed on the electrode of the semiconductor die and the electrode of the substrate by ejecting microdroplets of the metal nanoink () onto the electrodes, the semiconductor die is turned upside down and overlapped in alignment over the substrate, and then, the metal nanoparticles of the bumps are sintered under pressure by pressing and heating the bumps between the electrodes. As a result, generation of voids during sintering under pressure is minimized.

Metal nanoink and process for producing the metal nanoink, and die bonding method and die bonding apparatus using the metal nanoink

The present invention relates to ink jet printing ink consisting of an independently dispersed metal ultrafine particles-containing liquid dispersion in which the metal ultrafine particles having a particle size of not more than 100 nm are independently and uniformly dispersed and which is excellent in characteristic properties required for ink. The ink is used in the printing or the formation of conductive circuits using an ink jet printer. The ink can be prepared by steps comprising the first step in which metal vapor is brought into contact with vapor of the first solvent according to the evaporation-in-gas technique to thus form a metal ultrafine particles-containing liquid dispersion; the second step in which a low molecular weight polar solvent as the second solvent is added to the liquid dispersion to thus precipitate the metal ultrafine particles and to extract and remove the first solvent; and the third step in which the third solvent is added to the resulting precipitates to carry out solvent-substitution and to thus give a liquid dispersion containing metal ultrafine particles independently and uniformly dispersed therein, a dispersant being added in the first step and/or the third step.

Ink for ink jet printing and method for preparing the same

Each of the metal nano-particles present in a dispersion, which comprises at least one metal selected from the group consisting of precious metals and transition metals or an alloy of at least two metals selected from the foregoing metals, comprises a metal particle in which an organic metal compound of a fatty acid and/or an amine-metal complex is adhered to the periphery of the metal particle. This organic metal compound and the amine-metal complex are admixed together in a solvent and then the resulting mixture is subjected to a reducing treatment to thus form a dispersion containing metal nano-particles in a concentration of not less than 5% by mass and not more than 90% by mass. The resulting dispersion is applied onto the surface of a base material, followed by drying the applied layer of the dispersion and then firing the dried layer of the dispersion at a low temperature to thus form a thin metallic wire or a metal film having conductivity.

Metal nano-particles and method for preparing the same, dispersion of metal nano-particles and method for preparing the same, and thin metallic wire and metal film and method for preparing these substances

The present invention provides a method for forming an electrode of a flat panel display device using ink for ink jet printing and an ink jet printer. The ink for ink jet printing is prepared by a method comprising the first step of contacting the vapor of a metal with the vapor of the first solvent, according to the vapor phase-evaporation technique, to thus give a dispersion of metal ultrafine particles; the second step of adding a low molecular weight polar solvent as the second solvent to the dispersion prepared in the first step to thus precipitate the metal ultrafine particles and removing the first solvent; and the third step of adding the third solvent to the precipitates thus prepared to carry out the solvent substitution and to give a dispersion of independently dispersed metal ultrafine particles, and prepared by adding a dispersant in or during the foregoing first and/or third steps, and the ink for ink jet printing consists of a dispersion excellent in ink characteristic properties. In the dispersion, metal ultrafine particles having a particle size of not more than 100 nm are independently and uniformly dispersed. The electrodes of FPD devices are formed using this ink for ink jet printing.

Method for forming electrodes of flat panel display

This invention provides a low-temperature sintering conductive paste for high density circuit printing which can form a fine circuit having good adhesive force, a smooth surface and low resistance when applied on a substrate and then baked; the conductive paste of the invention uses, as conductive media, in combination with metal fillers having an average particle diameter of 0.5 to 20 &#x3bc;m, ultrafine metal particles having an average particle diameter of not larger than 100 nm, which are set in the state that the surfaces thereof are coated with one compound or more having a group comprising a nitrogen, oxygen, or sulfur atom and capable of coordinate-bonding by a lone pair existing in the atom, as a group capable of coordinate-bonding to a metal element contained in the ultrafine metal particles, and are dispersed uniformly in a resin composition comprising a heat curable resin component, an organic acid anhydride or a derivative thereof or an organic acid, and one or more organic solvent; and thereby it enables low-temperature sintering of the ultrafine metal particles during a heat treatment at a low temperature.

Electroconductive metal paste and method for production thereof

To provide a method for producing a sensing film for gas sensors by sintering particles comprising a metal or a metal oxide on a substrate, where the sensing film for gas sensors having excellent sensor properties such as sensitivity and responsibility can be easily and simply formed. A nano-meter order particle (), a dispersant () for preventing aggregation of the particles (), and a scavenger () for trapping the dispersant () at the sintering are mixed in a solvent () to prepare a paste body (), and this paste body () is coated on a base material and fired, thereby forming a sensing film.

Production method of gas sensor

Growing community of inventors

Chiba, Japan

Masaaki Oda