Fujitsu Corporation

Masaaki Norimatsu

Shinichi Hirose

Taisuke Iwai

Yoshitaka Yamaguchi

Yukie Sakita

Yohei Yagishita

Shinji Taniguchi

Masaharu Doi

Goji Nakagawa

Yoshihiro Mizuno

Seiki Sakuyama

Naoki Yamamoto

Koji Asano

Masaaki Ohyama

Daiyu Kondo

Kazuhiro Tanaka

Seimi Sasaki

Kazunori Miura

A photosensor device includes a substrate, a graphene layer provided on the substrate, a pair of electrodes electrically connected to the graphene layer, and a passivation layer formed of a resin and configured to cover the graphene layer. The graphene layer has holes which are periodically arranged, and the passivation layer is provided with openings that communicate with the holes. The side surfaces of the holes and the inner walls of the openings are continuously covered with an insulating thin film.

Photosensor device and method of manufacturing a photosensor device

A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.

Heat dissipation material and method of manufacturing thereof, and electronic device and method of manufacturing thereof

An electronic device includes: a semiconductor device; a heat-conductive resin, disposed above the semiconductor device, including a heat conductor and a resin; a linear carbon piece, disposed above the heat-conductive resin, to be thermally in contact with the heat conductor; and a heat spreader, disposed above the linear carbon piece, including a depressed portion having the heat-conductive resin.

Electronic device and method of manufacturing the same

A sheet structure has: a bundle structure including a plurality of linear structures made of carbon which are oriented in a predetermined direction; a covering layer covering the plurality of linear structures made of carbon; and a filling layer provided between the plurality of linear structures made of carbon covered with the covering layer. The thickness of the covering layer is not uniform in a direction crossing the predetermined direction.

Sheet structure, method of manufacturing sheet structure, and electronic device

A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.

Electronic component and method of manufacturing electronic component

The invention provides an optical device which can lower the drive voltage which is used as one of the parameters for performance evaluation of the optical device. The optical device includes a substrate having first and second ridges, first and second grooves, a third groove, and first and second banks formed thereon, a Mach-Zehnder optical waveguide formed on the substrate, and an electrode set including first and second signal electrodes and a grounding electrode for controlling light which propagates in the optical wveguide. The grounding electrode extends to the first groove adjacent to the first bank and the second groove adjacent to the second bank. The optical device is applied, for example, to a transmission side apparatus for a long distance optical transmission system.

Optical device

The invention provides an optical device which can lower the drive voltage which is used as one of the parameters for performance evaluation of the optical device. The optical device includes a substrate having first and second ridges, first and second grooves, a third groove, and first and second banks formed thereon, a Mach-Zehnder optical waveguide formed on the substrate, and an electrode set including first and second signal electrodes and a grounding electrode for controlling light which propagates in the optical waveguide. The grounding electrode extends to the first groove adjacent to the first bank and the second groove adjacent to the second bank. The optical device is applied, for example, to a transmission side apparatus for a long distance optical transmission system.

A photodetector module including a support substrate having a main surface, an optical waveguide mounted on the support substrate and having an end face for emerging a light beam along a first optical path, and a photodetector mounted on the support substrate so that the light beam emerged from the end face of the optical waveguide is incident on the photodetector, the photodetector having a photodetecting portion responding to the light beam incident on the photodetector. The photodetector module further includes a first inclined surface formed on a substrate of the photodetector for refracting the light beam along the first optical path to a second optical path, and a second inclined surface for totally reflecting the light beam along the second optical path to a third optical path substantially perpendicular to the photodetecting portion.

Photodetector module

A photoreception device includes an oblique surface on a semiconductor substrate for causing a deflection of an optical beam incident thereto and a photodetection region provided on a first side of the semiconductor substrate for detecting the deflected optical beam, the photodetection region including a first electrode, wherein the photoreception device further includes a second electrode for biasing the photodetection region an a second, opposite side of the semiconductor substrate.

Growing community of inventors

Atsugi, Japan

Masaaki Norimatsu