Ibiden Company Limited

Masaaki Murase

Takema Adachi

Takayuki Katsuno

A method for manufacturing an electronic component attached board includes preparing a first support plate, forming aggregate wiring boards on the first plate such that the aggregate boards each including wiring board side by side are formed in connected state on surface of the first plate, separating the first plate from the aggregate boards, dividing the aggregate boards into individual aggregate boards each including the wiring boards, bonding a second support plate to surface of each individual aggregate board such that each individual aggregate board is bonded to surface of the second plate, mounting electronic components on the wiring boards on the second plate such that each wiring board has an electronic component thereon, dividing the wiring boards into individual wiring boards, and separating the second plate from the individual wiring board. The surface of the first plate has size larger than size of the surface of the second plate.

Growing community of inventors

Ogaki, Japan

Masaaki Murase