Tokyo Electron Limited

Tokyo Electron Kyushu Limited

Masaaki Murakami

Takayuki Tomoeda

Kenichi Nishioka

Takashi Takekuma

Masami Akimoto

Kiyohisa Tateyama

Akihiro Fujimoto

Nobuo Konishi

Masatoshi Deguchi

Hideyuki Takamori

Tetsuya Oda

Hiroyuki Sakai

Kimiharu Matsumura

Norimitsu Morioka

Chizo Yamaguchi

The present invention provides a resist processing method for an object to be processed, including the processing step of supplying a process solution onto the object to be processed to perform a process on the object to be processed, and the cleaning step of supplying a cleaning solution onto the object to be processed to clean the object to be processed, wherein the processing step at least partially overlaps the cleaning step. The present invention also provides a resist processing method for an object to be processed, including the steps of positioning a process solution supply means for supplying a process solution above a quadrilateral object to be processed having a pair of opposing edges, moving the process solution supply means toward one edge of the pair of edges of the object to be processed relative to the object to be processed while supplying the process solution onto the object to be processed by the process solution supply means, and moving the process solution supply means from one edge of the object to be processed toward the other edge of the pair of edges of the object to be processed relative to the object to be processed while supplying the process solution onto the object to be processed by the process solution supply means.

Resist processing method and apparatus

A invention provides a resist processing method for an object to be processed, including the processing step of supplying a process solution onto the object to be processed to perform a process on the object to be processed, and the cleaning step of supplying a cleaning solution onto the object to be processed to clean the object to be processed, wherein the processing step at least partially overlaps the cleaning step. The present invention also provides a resist processing method for an object to be processed, including the steps of positioning a process solution supply means for supplying a process solution above a quadrilateral object to be processed having a pair of opposing edges, moving the process solution supply means toward one edge of the pair of edges of the object to be processed relative to the object to be processed while supplying the process solution onto the object to be processed by the process solution supply means, and moving the process solution supply means from one edge of the object to be processed toward the other edge of the pair of edges of the object to be processed relative to the object to be processed while supplying the process solution onto the object to be processed by the process solution supply means.

A coating apparatus comprises a chuck on which a semiconductor wafer is adhered, a resist liquid supplying system for supplying a resist liquid to the semiconductor wafer, a motor for rotating the semiconductor wafer, thereby spreading the resist liquid over the semiconductor wafer, and a plate, on which the semiconductor wafer is placed, for creating a temperature distribution on the semiconductor wafer.

Coating apparatus and method

A substrate solution-processing method comprising the steps of preparing a pair of spin chucks by which semiconductor wafers are supported, a housing by which the wafers supported by the spin chucks are enclosed, motor for rotating the spin chucks, a nozzle through which developing or resist solution is applied to each wafer, means for moving the nozzle between the wafers, and a waiting trench at which the nozzle is kept waiting, setting substantially same the times needed to finish the cycles of processing the wafers supported on at least two spin chucks and delaying one process cycle from the other, and keeping the nozzle waiting at the waiting trench unless developing or resist solution is applied to each wafer through the nozzle.

Method for applying process solution to substrates

CPU stores information showing a time-temperature relationship and applicable for either heating a semiconductor wafer to a hold temperature for a predetermined period of time or cooling the wafer from the hold temperature over a predetermined period of time, or for both, read the information. A conductive thin film heats the wafer in accordance with the information. A sensor detects the temperature of the wafer. A control system controls either the heating of the wafer or the cooling thereof, or both, in accordance with the detected temperature signal and the information.

Method for heat-processing semiconductor device and apparatus for the

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Kumamoto, Japan

Masaaki Murakami